Manufacturing Bits: May 19

By Mark LaPedus - 19 May, 2020 - Comments: 0

Virus simulations Using an advanced building simulator and testbed, Lawrence Berkeley National Laboratory (Berkeley Lab) is launching a study of the risk of airborne transmission of viruses in buildings. Researchers will also explore the ways to mitigate those risks. The experiments will take place in Berkeley Lab’s FLEXLAB, which is an advanced building simulator. Used by builders, archi... » read more

Power/Performance Bits: Feb. 25

By Jesse Allen - 25 Feb, 2020 - Comments: 0

Thinner, flexible touchscreens Researchers from RMIT University, University of New South Wales, and Monash University developed a thin, flexible electronic material for touchscreens. The material is 100 times thinner than current touchscreen materials. The new screens are still based on indium-tin oxide (ITO), a common touchscreen material. However, a liquid metal printing approach was used... » read more

Power/Performance Bits: April 5

By Jesse Allen - 05 Apr, 2016 - Comments: 0

DNA diodes Researchers at the University of Georgia and at Ben-Gurion University in Israel created nanoscale electronic components from single DNA molecules. "For 50 years, we have been able to place more and more computing power onto smaller and smaller chips, but we are now pushing the physical limits of silicon," said Bingqian Xu, an associate professor in the UGA College of Engineerin... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Ben-Gurion University

Manufacturing Bits: May 19

Power/Performance Bits: Feb. 25

Power/Performance Bits: April 5