Enabling New Functionality In Medtech And Biotech Devices

By Dick Otte - 18 May, 2023 - Comments: 0

Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of manufacturing challenges and demands that require heterogeneous integration (HI) to address. This two-part blog post provides a high... » read more

Unknowns And Challenges In Advanced Packaging

By Ed Sperling - 19 Jan, 2023 - Comments: 0

Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that conversation. SE: Companies have been designing heterogeneous chips to take advantage of specific applications or use cases, but th... » read more

Heterogeneous Integration: Fertile Ground For Medical And Biotech Innovation

By Promex Industries - 18 Jan, 2023 - Comments: 0

Sensing components in medical and biotech devices often place severe restrictions on the assembly methods that can be employed, which is part of what is driving heightened demand for heterogeneous integration (HI). It is the newest frontier for the medical and biotech manufacturing services industry to contribute our own innovations by developing the processes to build these unique combinations... » read more

How Chips Will Change Health Care

By Ed Sperling - 25 Aug, 2021 - Comments: 0

Jo De Boeck, chief strategy officer and executive vice president at imec, sat down with Semiconductor Engineering to talk about the intersection of medical and semiconductor technology, what's changing in how chips are being used, and what will happen in the short term and long-term. What follows are excerpts of that discussion. SE: Medical technology never advanced at the rate everybody... » read more

Rogue Valley Microdevices: MEMS Foundry

By Ed Sperling - 13 Mar, 2019 - Comments: 0

Venturing into the MEMS manufacturing market is a shaky proposition. The investment is high, the returns are questionable, and the competition can be fierce. Rogue Valley Microdevices is one of a handful of pure-play MEMS foundries in the United States, a difficult market divided into two distinct parts. One on side are a handful of higher-margin new technologies, such as piezoelectric micro... » read more

IP Liability Changes Ahead?

By Ed Sperling - 08 Dec, 2016 - Comments: 0

Patent lawyers are keeping close tabs on a biotech patent infringement case that went before the Supreme Court this week because it could have a significant impact on IP content in other markets, including semiconductors. On Tuesday, attorneys for Life Technologies Corp. and Promega Corp., presented arguments before the U.S. Supreme Court involving an enzyme for amplifying DNA analysis. For ... » read more

5 Technologies To Watch

By Mark LaPedus - 23 Jul, 2015 - Comments: 0

The industry is developing a dizzying array of new technologies. In fact, there are more new and innovative technologies than ever before. And the list is countless. At least from my vantage point, I have come up with my own list of the top five technologies to watch in 2015 and beyond. They are listed in alphabetical order. (See below). Obviously, there are more than just five technologi... » read more

Blog Review: June 25

By Ed Sperling - 25 Jun, 2014 - Comments: 0

Is the Amazon Fire smart phone a paradigm shift? Cadence’s Brian Fuller looks at the first application-specific smart phone and why it’s noteworthy—regardless of how well it fares against phones made by Apple and Samsung. Rambus’ Deepak Chandra Sekar digs deep into interconnect technology and where the prevailing winds are blowing—copper barrier/cap/liner optimization, a slowdown i... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.