Why DSA Is Cost Effective For 7nm And Below

By Yuansheng Ma - 30 Jul, 2015 - Comments: 0

The upcoming 7nm process node presents tough challenges both for printability and cost. At 7nm and below, multi-patterning is required, which makes the manufacturing process more expensive by requiring more masks. To control costs, any alternative technology that provides equivalent yields with fewer patterning steps should be explored. One promising option is to use directed self-assembly (... » read more

DSA Defects Continue Downward Trend

By Katherine Derbyshire - 06 Apr, 2015 - Comments: 0

As previously discussed, the majority of defects in early directed self-assembly (DSA) processes were due to particles and other contaminants, and could be attributed to the immaturity of the process and materials. As manufacturers consider whether to incorporate DSA into specific technology nodes, they need to assure themselves that production-worthy yields can be achieved. Recent research at ... » read more

Integrating DSA

By Katherine Derbyshire - 22 Dec, 2014 - Comments: 0

As previous articles in this series have shown, directed self-assembly may be a promising alternative for manufacturers seeking to shrink feature sizes in the face of a stalled exposure tool roadmap. It is simpler than some other frequency-multiplication techniques, can be implemented with existing equipment, and does not appear to introduce insurmountable defect issues of its own. Which does n... » read more

DSA Moves Ahead

By Katherine Derbyshire - 19 Dec, 2014 - Comments: 0

It can be difficult to make DSA structures other than uniform arrays. One solution is to print a grating over a large area, then use a “cut” mask to eliminate the unwanted features. The challenge, though, is that aligning the cut mask to an array of tightly spaced features, such as the fins for a FinFET transistor layer, can require extremely demanding overlay specifications. While reducing... » read more

Counting And Controlling DSA Defects

By Katherine Derbyshire - 13 Nov, 2014 - Comments: 1

If directed self-assembly is to succeed in semiconductor manufacturing, [gettech id="31046" t_name="DSA"] processes must achieve defect rates in line with the stringent requirements of sub-20nm device nodes. So far, they haven’t. However, it’s not yet clear whether the high defect rates represent a real obstacle, or are simply part of the development of any new, immature process technology... » read more

The Key To DSA

By Katherine Derbyshire - 16 Oct, 2014 - Comments: 0

The block co-polymer most commonly used in directed self-assembly research ([gettech id="31046" t_name="DSA"]), PS-b-PMMA (poly(styrene-block-methyl methacrylate) is an excellent choice because the two component monomers have similar surface energies. The exposed top surface of the film helps to stabilize the segregated domains, making it relatively easy to achieve the lamellar line-and-space p... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.