tag: Boeing

Chip Industry Week In Review
By The SE Staff - 04 Oct, 2024 - Comments: 0

Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Digital Twins Find Their Footing In IC Manufacturing
By Laura Peters - 09 Jul, 2024 - Comments: 0

Momentum is building for digital twins in semiconductor manufacturing, tying together the various processes and steps to improve efficiency and quality, and to enable more flexibility in the fab and assembly house. The movement toward digital twins opens up a slew of opportunities, from building and equipping new fabs faster to speeding yield ramps by reducing the number of silicon-based tes... » read more

Chip Industry Week In Review
By The SE Staff - 16 Feb, 2024 - Comments: 0

By Susan Rambo, Karen Heyman, and Liz Allan. Renesas plans to acquire Altium, maker of PCB design software, for $5.9 billion. In a conference call, Renesas CEO Hidetoshi Shibata cited Altium's PCB design software and digital twin virtual modeling as key components of its future strategy. "I believe it will generate transformational value for our combined customers and our stakeholders," Shib... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 30 Jul, 2021 - Comments: 0

Automotive SGS-TÜV Saar certified that Cadence’s Tensilica Xtensa processors with FlexLock meets the ISO 26262:2018 standard to ASIL-D level. The new FlexLock feature is key to the certification because it supports lockstep, a fault-tolerant method that runs the same operation on two cores at the same time and then compares the output. Any difference in the output can be examined for issues... » read more

Manufacturing Bits: June 22
By Mark LaPedus - 22 Jun, 2021 - Comments: 1

5G metasurface antennas At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), the Institute of Microelectronics of the Chinese Academy of Sciences (CAS) presented a paper on a low-profile broadband metasurface antenna for 5G antenna-in-package applications. The National Center for Advanced Packaging and the University of Chinese Academy of Sciences also contri... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Mar, 2021 - Comments: 0

Chipmakers and OEMs Micron will cease development of 3D XPoint, a next-generation memory technology. Micron also plans to sell a fab that produces 3D XPoint chips. For some time, Intel and Micron have co-developed 3D XPoint, which is based on phase-change memory technology. Intel sells solid-state storage drives (SSDs) using 3D XPoint. In a fab located in Utah, Micron is producing this memo... » read more

The Good, Bad And Unknowns Of Flexible Devices
By Ed Sperling - 27 Jan, 2021 - Comments: 0

Flexible hybrid electronics are beginning to proliferate in consumer, medical, and industrial applications due to their comparatively low weight, thin profile, and the ability to literally bend the rules of design. Open any smart phone today and you're likely to find one or more of these flexible boards. Unlike standard printed circuit boards, FHE devices are printed using a combination of r... » read more

Manufacturing Bits: Jan. 5
By Mark LaPedus - 05 Jan, 2021 - Comments: 0

Gallium oxide chips The National Renewable Energy Laboratory (NREL), the Colorado School of Mines, and Saint-Gobain Crystals have teamed up to develop manufacturing technologies and devices based on an emerging material called gallium oxide. This work is part of a three-year program, dubbed the Oxide Electronic Devices for Extreme Operating Environments project, which is funded by the U.S. ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 18 Sep, 2020 - Comments: 0

Security Synopsys’ Software Integrity Group published the results of a security survey that looked at the ways organizations across industries are handling their software security initiatives and how to improve them. The Building Security In Maturity Model (BSIMM) version 11 (BSIMM11 Study) describes the work of 8,457 software security pros. FinTech — the technology that “follows the mon... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 07 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Codasip and Metrics Design Automation announced they have integrated Metrics’ SystemVerilog RTL Simulation Platform within Codasip’s SweRV Core Support Package, version, and it will be accessible on the cloud. Aldec’s TySOM Embedded Development Kits have qualified for Amazon Web Services (AWS) IoT Greengrass. TySOM is a family of Xilinx Z... » read more

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