DARPA CHIPS Program Pushes For Chiplets


While the semiconductor industry plugs away at More Than Moore innovation, the U.S. government is guiding its own SoC development. A new program kicked off last year called ‘Common Heterogeneous Integration and IP Reuse Strategies’ or CHIPS to take its own approach the incredibly high cost of SoC design and manufacturing. DARPA said it recognizes that the explosive growth in mobile and t... » read more

Tech Talk: DO-254


Aldec's Louie De Luna explains the safety critical standard for the aerospace industry and how that parallels what's happening in automotive electronics. https://youtu.be/qa1g1NNVj60 » read more

Manufacturing Bits: Aug. 1


Magnetic chips HRL Laboratories—an R&D venture between Boeing and General Motors—has been awarded a contract to develop a new class of magnetic integrated components. HRL has received the award from the Defense Advanced Research Project Agency (DARPA) under the Magnetic, Miniaturized, and Monolithically Integrated Components (M3IC) program. The goal is to develop new magnetic materials... » read more

Quality Issues Widen


As the amount of semiconductor content in cars, medical and industrial applications increases, so does the concern about how long these devices will function properly—and what exactly that means. Quality is frequently a fuzzy concept. In mobile phones, problems have ranged from bad antenna placement, which resulted in batteries draining too quickly, to features that take too long to load. ... » read more

Manufacturing Bits: Jan. 3


3D printed military drones The U.S. Army Research Laboratory has begun testing 3D printed drones for use in on-demand military missions. The technology, called the On-Demand Small Unmanned Aircraft System (ODSUAS), enables a soldier to input the mission requirements in software. Then, a 3D printer devises the optimal configuration for an unmanned aerial vehicle. And it’s printed and deliv... » read more

The Week In Review: IoT


Deals Verizon Communications reported acquiring the assets of LQD WiFi LLC, expanding its smart city portfolio; financial terms weren’t revealed. Mike Lanman, senior vice president, Enterprise Products and Internet of Things at Verizon, said in a statement: “LQD’s Palo technology hubs capture Verizon’s vision of delivering citizen engagement experiences by connecting people with their ... » read more

Manufacturing Bits: Nov. 1


U.S. to boost IC competitiveness President Obama’s Council of Advisors on Science & Technology (PCAST) has launched a new semiconductor working group in the United States. The new working group will focus on ways to strengthen the competitiveness of the U.S. semiconductor industry. It will provide recommendations to PCAST regarding the challenges facing the U.S. semiconductor industry. Th... » read more

Too Big To Simulate?


With system design complexity set on a steady upward trajectory, there are situations in which traditional simulation just can’t keep up. The alternative—and one being used by Google, Uber, Ford, GM, Volvo, Audi and others with autonomous vehicles— is to test cars on the road and collect data for later analysis. “They're not simulating, they're just doing it all in the real world ... » read more

Manufacturing Bits: Sept. 6


DARPA ALD The University of Colorado at Boulder has developed an atomic layer deposition (ALD) technology that can be performed at room temperatures. The technology, dubbed electron-enhanced ALD (EE-ALD), has been developed as part of the Local Control of Materials Synthesis (LoCo) program at the U.S. Defense Advanced Research Projects Agency (DARPA). The LoCo program is developing tech... » read more

Flexible Sensors Begin Ramping


Sensors are at the heart of the [getkc id="76" comment="Internet of Things"]. Flexible sensors promise to extend the Internet of Everything to the battlefield, the gymnasium, the hospital, and many other places. Flexible [getkc id="187" kc_name="sensors"] represent the forefront of a sea of change in electronics, marking the transition from rigid semiconductors made with silicon and other ha... » read more

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