Dirty Data: Is the Sensor Malfunctioning?


Sensors provide an amazing connection to the physical world, but extracting usable data isn't so simple. In fact, many first-time IoT designers are unprepared for how messy a sensor’s data can be. Every day the IoT motion-sensor company MbientLab struggles to tactfully teach its customers that the mountain of data they are seeing is not because the sensors are faulty. Instead, the system d... » read more

Reconfigurable eFPGA For Aerospace Applications


Market research reports indicate about 10% of all dollar revenue of FPGA chips is for use in aerospace applications, and DARPA/DoD reports indicate about one-third of all dollar volume of ICs purchased by U.S. aerospace are FPGAs. FPGAs clearly are very important for aerospace applications because of a combination of short development time and the long mission life of many aerospace applica... » read more

Week in Review: IoT, Security, Auto


Internet of Things Amazon Web Services announced that Iridium Communications has joined the AWS Partner Network. AWS and Iridium have collaborated on development of Iridium CloudConnect, a service that enables worldwide coverage for Internet of Things applications through Iridium’s satellite network. AWS IoT is being paired with Iridium IoT services as a result. IHS Markit forecasts there wi... » read more

Week In Review: Design, Low Power


Mirabilis Design debuted an AI-driven tool for performance analysis and architecture exploration of SoCs and embedded systems. VisualSim AI Processor Generator creates pipeline-accurate models that have port integration with standard buses and memories, which is used to compare different processor families, optimize the specification and identify system bottlenecks. The generated model supports... » read more

Week In Review: Manufacturing, Test


Tariffs The Federal Communications Commission (FCC) took a step in its ongoing efforts to remove regulatory barriers that inhibit the deployment of infrastructure necessary for 5G and other advanced wireless services in the U.S. "5G networks in America are key for powering the next generation of innovation, such as artificial intelligence, the Internet of Things and smart cities. (The FCC... » read more

Week In Review: Design, Low Power


Arm announced a new processor targeted at autonomous driving applications. The Cortex-A76AE is a superscalar, out-of-order processor that incorporates Split-Lock safety technology. Split-Lock allows CPU clusters in an a SoC to be configured either in ‘split mode’ for high performance, allowing two (or four) independent CPUs in the cluster to be used for diverse tasks and applications, or ... » read more

Week in Review: IoT, Security, Auto


Internet of Things Silicon Labs worked with Norway’s Q-Free to create the ParQSense Smart Parking Sensor, which helps drivers find available outdoor parking spaces. ParQSense uses the chip company’s Wonder Gecko wireless microcontroller for connectivity and control. Having gone through pilot testing in the European Union and North America this year, ParQSense is being released for commerci... » read more

Manufacturing Bits: Sept. 4


Flat diamond chips Kanazawa University and the National Institute of Advanced Industrial Science and Technology (AIST) have developed a process that solves a big issue for diamond semiconductors in power applications. Researchers have developed a water vapor annealing technique that creates atomically flat diamond surfaces. This brings diamond semiconductors one step closer to becoming more... » read more

Week in Review: IoT, Security, Auto


Internet of Things Electrolux, Haier, LG Electronics, and Samsung Electronics announced they are working with the Open Connectivity Foundation, an Internet of Things standards body, to build, commercialize, and deploy interoperable OCF-Certified connected products during 2019. In addition, the OCF is launching an enhanced security model and secure cloud management capabilities, making use of p... » read more

The Chiplet Race Begins


Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

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