Manufacturing Bits: Jan. 3


3D printed military drones The U.S. Army Research Laboratory has begun testing 3D printed drones for use in on-demand military missions. The technology, called the On-Demand Small Unmanned Aircraft System (ODSUAS), enables a soldier to input the mission requirements in software. Then, a 3D printer devises the optimal configuration for an unmanned aerial vehicle. And it’s printed and deliv... » read more

The Week In Review: IoT


Deals Verizon Communications reported acquiring the assets of LQD WiFi LLC, expanding its smart city portfolio; financial terms weren’t revealed. Mike Lanman, senior vice president, Enterprise Products and Internet of Things at Verizon, said in a statement: “LQD’s Palo technology hubs capture Verizon’s vision of delivering citizen engagement experiences by connecting people with their ... » read more

Manufacturing Bits: Nov. 1


U.S. to boost IC competitiveness President Obama’s Council of Advisors on Science & Technology (PCAST) has launched a new semiconductor working group in the United States. The new working group will focus on ways to strengthen the competitiveness of the U.S. semiconductor industry. It will provide recommendations to PCAST regarding the challenges facing the U.S. semiconductor industry. Th... » read more

Too Big To Simulate?


With system design complexity set on a steady upward trajectory, there are situations in which traditional simulation just can’t keep up. The alternative—and one being used by Google, Uber, Ford, GM, Volvo, Audi and others with autonomous vehicles— is to test cars on the road and collect data for later analysis. “They're not simulating, they're just doing it all in the real world ... » read more

Manufacturing Bits: Sept. 6


DARPA ALD The University of Colorado at Boulder has developed an atomic layer deposition (ALD) technology that can be performed at room temperatures. The technology, dubbed electron-enhanced ALD (EE-ALD), has been developed as part of the Local Control of Materials Synthesis (LoCo) program at the U.S. Defense Advanced Research Projects Agency (DARPA). The LoCo program is developing tech... » read more

Flexible Sensors Begin Ramping


Sensors are at the heart of the [getkc id="76" comment="Internet of Things"]. Flexible sensors promise to extend the Internet of Everything to the battlefield, the gymnasium, the hospital, and many other places. Flexible [getkc id="187" kc_name="sensors"] represent the forefront of a sea of change in electronics, marking the transition from rigid semiconductors made with silicon and other ha... » read more

Manufacturing Bits: Jan. 5


New materials for 3D printing HRL Laboratories has developed a new ceramic technology for 3D printing. The technology overcomes the limits of traditional ceramic processing, thereby enabling high-strength components. Ceramics are much more difficult to process than traditional 3D printing materials, such as polymers or metals, according to HRL, a corporate R&D laboratory owned by The Boeing... » read more

Manufacturing Bits: Oct. 6


Magnetic mass spectrometers The National High Magnetic Field Laboratory (National MagLab) has developed a mass spectrometer, based on what the organization claims is the world’s highest field superconducting magnet. The instrument from National MagLab is called a Fourier transform ion cyclotron resonance (FT-ICR) mass spectrometer. The mass spectrometer boasts a 21 tesla magnet, which is ... » read more

Inside The System-Level Supply Chain


System-Level Design sat down to discuss supply chain issues with Bill Chown product marketing director for the system-level engineering division at Mentor Graphics and a longtime participant in a number of standards efforts across the semiconductor design industry. What follows are excerpts of that conversation. SLD: What’s happening with system engineering as chip design/manufacturing mo... » read more

Mixed-Signal Technology Summit Proceedings


On September 20 Cadence held the second Mixed-Signal Technology Summit. Experts from Cadence and other leading companies presented the latest mixed-signal design methodologies. If you missed the event, you can still view the material via the below archived proceedings. To view the presentations and videos, click here. » read more

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