tag: BoW

Accellera Preps New Standard For Clock-Domain Crossing
By Brian Bailey - 29 Feb, 2024 - Comments: 0

Part of the hierarchical development flow is about to get a lot simpler, thanks to a new standard being created by Accellera. What is less clear is how long will it take before users see any benefit. At the register transfer level (RTL), when a data signal passes between two flip flops, it initially is assumed that clocks are perfect. After clock-tree synthesis and place-and-route are perfor... » read more

Integration Challenges For RISC-V Designs
By Ed Sperling - 27 Feb, 2024 - Comments: 0

One of the big draws of RISC-V is that it allows design teams to create unique chips or chiplets and to make modifications to the instruction-set architecture. That extra degree of freedom also creates some issues when it comes to integrating those designs into packages or systems because they may require non-standard connectivity approaches. Frank Schirrmeister, vice president of marketing at ... » read more

UCIe Goes Back To The Drawing Board
By Gregory Haley - 22 Feb, 2024 - Comments: 0

The integration of multiple dies within a single package increasingly is viewed as the next evolution for extending Moore’s Law, but it also presents myriad challenges — particularly in achieving a universally accepted standard integrating plug-and-play chiplets from different vendors. “In some respects, people are already doing this,” says Debendra Das Sharma, Intel senior fellow an... » read more

Why Chiplets Are So Critical In Automotive
By John Koon - 20 Feb, 2024 - Comments: 1

Chiplets are gaining renewed attention in the automotive market, where increasing electrification and intense competition are forcing companies to accelerate their design and production schedules. Electrification has lit a fire under some of the biggest and best-known carmakers, which are struggling to remain competitive in the face of very short market windows and constantly changing requir... » read more

IC Package Physical Design Best Practices
By Siemens EDA - 15 Feb, 2024 - Comments: 0

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed circuit board (PCB). But today the industry is moving to disaggregation of traditional monolithic SoC functions into chiplets often interfaced with local high-speed memory to avoid silicon reticle limits... » read more

2023: A Good Year For Semiconductors
By Brian Bailey - 21 Dec, 2023 - Comments: 0

Looking back, 2023 has had more than its fair share of surprises, but who were the winners and losers? The good news is that by the end of the year, almost everyone was happy. That is not how we exited 2022, where there was overcapacity, inventories had built up in many parts of the industry, and few sectors — apart from data centers — were seeing much growth. The supposed new leaders we... » read more

Making Heterogeneous Integration More Predictable
By Ed Sperling - 29 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom I... » read more

Heterogeneous Integration Finding Its Footing
By Ed Sperling - 19 Oct, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom IC & PCB Group; and Tony Mastroianni, advanced packagin... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Why Auto Ecosystem Relationships Are Changing
By Ann Mutschler - 19 Jun, 2023 - Comments: 0

The automotive industry is in the midst of rapid change on many fronts. OEMs are exploring new functions and features to add to their vehicles, including chiplets, electrification, autonomous features, as well as new vehicle architectures that will determine how vehicles are going to be designed from the foundation up. But all of this is dependent on the relationships between all of the ecosyst... » read more

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