tag: BoW

Chiplets: More Standards Needed
By Andy Heinig - 13 Apr, 2023 - Comments: 1

Recent months have seen new advances in chiplet standardization. For example, consortia such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) have made progress in developing standards for die-to-die (D2D) interfaces in a chiplet’s design. Far from being a new phenomenon in communication, these types of standards are established for all forms of wired and wireless com... » read more

Will AI Take My Job?
By Brian Bailey - 23 Feb, 2023 - Comments: 0

Everyone is talking about ChatGPT these days, and I am sure we will be comparing it with Google's new offering before long. I thought it was time that I gave it a quick spin, and since I am preparing to moderate a webinar about chiplets as I write this, I decided it was a good example of a fairly new field and would be a good test. I started by asking, "What are semiconductor chiplets, what ... » read more

Is UCIe Really Universal?
By Brian Bailey - 22 Nov, 2022 - Comments: 3

Chiplets are rapidly becoming the means to overcome the slowing of Moore's Law, but whether one interface is capable of joining them all together isn't clear yet. The Universal Chiplet Interconnect Express (UCIe) believes it will work, but some in the industry remain unconvinced. At least part of the problem is that interconnect standards are never truly finished. Even today, the protocols tha... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 29 Jul, 2022 - Comments: 1

The U.S. Congress approved the CHIPS Act, a mammoth bipartisan achievement the New York Times called “the most significant government intervention in industrial policy in decades.” As passed, the full package — now called the Chips and Science Act — contains $52 billion in direct assistance for the semiconductor industry, along with $24 billion in tax incentives. In addition, the bill c... » read more

Heterogenous Integration Creating New IP Opportunities
By Brian Bailey - 19 Jul, 2022 - Comments: 0

The design IP market has long been known for constant change and evolution, but the industry trend toward heterogenous integration and chiplets is creating some new challenges and opportunities. Companies wanting to stake out a claim in this area have to be nimble, because there will be many potential standards introduced, and they are likely to change quickly as the industry explores what is r... » read more

Chiplets: Current Status
By Andy Heinig - 12 May, 2022 - Comments: 0

Recent weeks have seen a number of interesting developments in the area of chiplets. An increasing number of products based on chiplets have been brought to market, especially in the processors segment. For example, Apple and AMD now have processors with chiplets on the market and under production in high volumes. On one hand, this means that sufficient production capacity has now been built up... » read more

Clocks Getting Skewed Up
By Brian Bailey - 30 Mar, 2022 - Comments: 0

At a logical level, synchronous designs are very simple and the clock just happens. But the clocking network is possibly the most complex in a chip, and it's fraught with the most problems at the physical level. To some, the clock is the AC power supply of the chip. To others, it is an analog network almost beyond analysis. Ironically, there are no languages to describe clocking, few tools t... » read more

Missing Interposer Abstractions And Standards
By Brian Bailey - 29 Nov, 2021 - Comments: 0

The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, it will be a technique that only large companies can deploy because they need to treat everything almost as if it were a single die. The construction of large systems uses techniques, such as ab... » read more

Waiting For Chiplet Standards
By Brian Bailey - 25 Mar, 2021 - Comments: 2

The need and desire for chiplets is increasing, but for most companies that shift will happen slowly until proven standards are in place. Interoperability and compatibility depend on many layers and segments of the supply chain coming to agreement. Unfortunately, fragmented industry requirements may lead to a plethora of solutions. Standards always have enabled increasing specialization. ... » read more

The Good And Bad Of Chiplets
By Mark LaPedus - 27 May, 2020 - Comments: 1

The chiplet model continues to gain traction in the market, but there are still some challenges to enable broader support for the technology. AMD, Intel, TSMC, Marvell and a few others have developed or demonstrated devices using chiplets, which is an alternative way to develop an advanced design. Beyond that, however, the adoption of chiplets is limited in the industry due to ecosystem issu... » read more

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