Chip Industry Week in Review

By The SE Staff - 02 May, 2025 - Comments: 0

Check out the Inside Chips podcast for our behind-the-scenes analysis of changes at Intel Foundry. Intel rolled out its updated process technology roadmap this week, along with early process design kit (PDK) for its 14A gate-all-around process technology. That node will utilize high-NA EUV, and include direct contact power delivery, the second generation of its backside power delivery techno... » read more

Packaging With Fewer People And Better Results

By Gregory Haley - 17 Apr, 2025 - Comments: 0

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of overall device performance. In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in verticall... » read more

Four Things Every Engineer Should Know About PFAS

By Jessica Albright - 20 Mar, 2025 - Comments: 0

What are PFAS chemicals? “PFAS” is an acronym for per- and polyfluoroalkyl substances. These man-made chemicals migrate into soil, water, and air when produced and used. There are many ways humans come in contact with PFAS, such as in non-stick cookware or cosmetics, but by far the most significant impact on human health is when PFAS is consumed in drinking water. Exposure to PFAS may resu... » read more

The Rise Of Thin Wafer Processing

By Laura Peters - 20 Mar, 2025 - Comments: 0

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the amount of energy needed to drive them. Markets calling for ultrathin wafers are growing. The combined thickness of an HBM module with 12 DRAM dies and a base logic chip is still less than that of a ... » read more

Many Options For EUV Photoresists, No Clear Winner

By Katherine Derbyshire - 20 Mar, 2025 - Comments: 2

In EUV lithography, and especially high-numerical-aperture EUV, balancing tradeoffs between resolution, sensitivity and line-width roughness is becoming increasingly difficult. Lithography patterning using extreme UV exposure depends on a resist mask that can simultaneously meet targets of small feature resolution, high sensitivity to EUV wavelength, and acceptable linewidth roughness. Unfor... » read more

Chip Industry Week In Review

By The SE Staff - 28 Feb, 2025 - Comments: 0

Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Chip Industry Week In Review

By The SE Staff - 21 Feb, 2025 - Comments: 0

The EU Commission approved €920 million in German State aid to support Infineon in setting up its Smart Power Fab in Dresden. Total funding for the Dresden site amounts to about €1 billion. PDF Solutions will acquire secureWISE for $130 million to expand the reach of its semiconductor manufacturing data platform, providing secure, remote access monitoring and control. Tariffs, trade, and ... » read more

Back-End Packaging And Test: From Lessons Learned To Future Innovations

By Jessica Albright - 20 Feb, 2025 - Comments: 0

The semiconductor industry is a hallmark of technological innovation, evolving rapidly to meet the demands of an increasingly digital world. At its core, semiconductor manufacturing involves two main stages: front-end processes, (wafer fabrication) and back-end processes (packaging and test). Wafer fabrication consists of creating microscopic electronic circuits on a silicon wafer. Packaging an... » read more

EUV’s Future Looks Even Brighter

By Gregory Haley - 20 Feb, 2025 - Comments: 1

The rapidly increasing demand for advanced-node chips to support everything-AI is putting pressure on the industry's ability to meet demand. The need for cutting-edge semiconductors is accelerating in applications ranging from hyperscale data centers powering large language models to edge AI in smartphones, IoT devices, and autonomous systems. But manufacturing those chips relies heavily on ... » read more

Electrifying Everything: Power Moves Toward ICs

By Gregory Haley - 23 Jan, 2025 - Comments: 0

As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. The next wave of innovation is to bring power control closer to the action — directly on the chip or into a heterogeneous package. This change is driven by a relentless pursuit of efficiency, scala... » read more

← Older posts

tag: Brewer Science

Chip Industry Week in Review

Packaging With Fewer People And Better Results

Four Things Every Engineer Should Know About PFAS

The Rise Of Thin Wafer Processing

Many Options For EUV Photoresists, No Clear Winner

Chip Industry Week In Review

Chip Industry Week In Review

Back-End Packaging And Test: From Lessons Learned To Future Innovations

EUV’s Future Looks Even Brighter

Electrifying Everything: Power Moves Toward ICs

Trending Articles

Advanced Packaging Fundamentals for Semiconductor Engineers

Chiplet Tradeoffs And Limitations

2030 Data Center AI Chip Winners: The Trillion Dollar Club

AI Agents Need Goals