tag: Brewer Science

Fan-Out Packaging Options Grow
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and sma... » read more

High-Temperature-Stable, Spin-On Carbon Materials For High-Aspect-Ratio Gap-Fill Applications
By Brewer Science - 16 Jun, 2021 - Comments: 0

Brewer Science, Inc. has developed a class of novel, high-temperature-stable spin-on carbon (SOC)-based materials with excellent processability. These SOCs are cured under mild conditions and have flow properties that enable the fill of high-aspect-ratio vias in a void-free manner. Moreover, this new class of SOCs has remarkable thermal stability and can survive temperatures of up to 550°C wit... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 11 Jun, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Xilinx introduced its Versal AI Edge series of adaptive SoCs, or adaptive compute acceleration platforms (ACAPs), that can be manage AI-ML workloads in edge applications. The chip is designed for flexible, low latency, edge applications where algorithms may need updating. The software programmable chips have an AI Engine-ML featur... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Jun, 2021 - Comments: 0

Government policy The Malaysian government has extended its lockdown due to the pandemic until June 14, a move that may impact the global electronics supply chain, according to TrendForce. Malaysia recently implemented MCO 3.0 (Movement Control Order), the nation’s pandemic control measure. Malaysia is home to many fab equipment, packaging and testing facilities, as well as passive compon... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 May, 2021 - Comments: 0

Government policy The U.S. government hopes to build more fabs and expand its R&D efforts in the United States. To help enable those efforts, U.S. Senate Majority Leader Charles Schumer has introduced the new bipartisan U.S. Innovation and Competition Act. This combines Schumer’s Endless Frontier Act and other bipartisan competitiveness bills. It includes $52 billion in emergency supplem... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 May, 2021 - Comments: 0

Packaging and test TrendForce has released its ranking of the top OSATs in terms of sales in the first quarter of 2021. ASE remains in the top spot, followed in order by Amkor, JCET, SPIL and PTI. “Industry leaders ASE and Amkor posted revenues of $1.69 billion and $1.33 billion, which are YoY increases of 24.6% and 15.0%, respectively, in 1Q21,” according to TrendForce. “ASE graduall... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 21 May, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Combining AI with IoT not only gives another acronym AIoT, or Artificial Intelligence of Things, but it puts AI systems on the edge. Infineon Technologies has released its ModusToolbox Machine Learning to make it possible to run deep learning-based workloads on Infineon’s PSoC microcontrollers. The toolbox has middleware, softwa... » read more

Advanced Packaging’s Next Wave
By Mark LaPedus - 20 May, 2021 - Comments: 0

Packaging houses are readying the next wave of advanced packages, enabling new system-level chip designs for a range of applications. These advanced packages involve a range of technologies, such as 2.5D/3D, chiplets, fan-out and system-in-package (SiP). Each of these, in turn, offers an array of options for assembling and integrating complex dies in an advanced package, providing chip custo... » read more

Improvement Of EUV Si Hardmask Performance Through Wet Chemistry Functionalization
By Brewer Science - 20 May, 2021 - Comments: 0

In EUV lithography, spin-on silicon hardmasks have been widely used not only as etch transfer layers, but also as assist layers to enhance the lithographic performance of resist. In this study, we demonstrate a novel approach to functionalize spin-on silicon hardmasks by hybridizing them with functional groups through a sol-gel approach. By varying the concentration and type of the functional g... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 May, 2021 - Comments: 0

Government policy Semiconductor companies as well hardware and software vendors have announced the formation of the Semiconductors in America Coalition (SIAC). The group called on congressional leaders to appropriate $50 billion for U.S. manufacturing incentives and research initiatives. SIAC’s mission is to advance federal policies that promote semiconductor manufacturing and research in th... » read more

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