tag: Brewer Science

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 May, 2021 - Comments: 0

Packaging and test TrendForce has released its ranking of the top OSATs in terms of sales in the first quarter of 2021. ASE remains in the top spot, followed in order by Amkor, JCET, SPIL and PTI. “Industry leaders ASE and Amkor posted revenues of $1.69 billion and $1.33 billion, which are YoY increases of 24.6% and 15.0%, respectively, in 1Q21,” according to TrendForce. “ASE graduall... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 21 May, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Combining AI with IoT not only gives another acronym AIoT, or Artificial Intelligence of Things, but it puts AI systems on the edge. Infineon Technologies has released its ModusToolbox Machine Learning to make it possible to run deep learning-based workloads on Infineon’s PSoC microcontrollers. The toolbox has middleware, softwa... » read more

Advanced Packaging’s Next Wave
By Mark LaPedus - 20 May, 2021 - Comments: 0

Packaging houses are readying the next wave of advanced packages, enabling new system-level chip designs for a range of applications. These advanced packages involve a range of technologies, such as 2.5D/3D, chiplets, fan-out and system-in-package (SiP). Each of these, in turn, offers an array of options for assembling and integrating complex dies in an advanced package, providing chip custo... » read more

Improvement Of EUV Si Hardmask Performance Through Wet Chemistry Functionalization
By Brewer Science - 20 May, 2021 - Comments: 0

In EUV lithography, spin-on silicon hardmasks have been widely used not only as etch transfer layers, but also as assist layers to enhance the lithographic performance of resist. In this study, we demonstrate a novel approach to functionalize spin-on silicon hardmasks by hybridizing them with functional groups through a sol-gel approach. By varying the concentration and type of the functional g... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 May, 2021 - Comments: 0

Government policy Semiconductor companies as well hardware and software vendors have announced the formation of the Semiconductors in America Coalition (SIAC). The group called on congressional leaders to appropriate $50 billion for U.S. manufacturing incentives and research initiatives. SIAC’s mission is to advance federal policies that promote semiconductor manufacturing and research in th... » read more

Blog Review: May 5
By Jesse Allen - 05 May, 2021 - Comments: 0

Arm's William Wang considers how to increase the performance and programmability of persistent applications through using battery to protect the on-chip volatile cache hierarchy. Cadence's Paul McLellan finds that ransomware is getting more sophisticated, and more difficult to eradicate and defend against, with potentially life-threatening consequences. Synopsys' Jonathan Knudsen digs int... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Apr, 2021 - Comments: 0

Chipmakers TSMC has posted strong results and raised its capital spending budget to $30 billion, up from its prior guidance of $25 billion to $28 billion in 2021. “Its outlook indicates broad-based semiconductor demand continues to strengthen amid supply chain tightness,” said Weston Twigg, an analyst at KeyBanc, in a research note. “TSMC posted another quarter of strong demand for leadi... » read more

Making Chip Packaging More Reliable
By Mark LaPedus - 15 Apr, 2021 - Comments: 0

Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Apr, 2021 - Comments: 0

Government policy President Biden has rolled out a proposal to boost the infrastructure in the U.S. As part of the plan, the president is calling on Congress to invest $50 billion in U.S. semiconductor manufacturing and research. The proposal must pass Congress, which isn’t going to be easy. “The President’s plan would invest ambitiously in U.S. semiconductor workers, manufacturing, and ... » read more

What Goes Wrong In Advanced Packages
By Ed Sperling - 24 Mar, 2021 - Comments: 1

Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore's Law and the ITRS roadmap created a semi-standardized path forward for the chip industry. Different advanced packaging options — system-in-package, fan-outs, 2.5D, 3D-IC — have a... » read more

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