tag: Brewer Science

Photonic Debonding Provides A Cost-Efficient, High-Throughput Debond Process
By Jessica Albright - 18 Jan, 2024 - Comments: 0

As emerging technologies require ultrathinned device wafers, traditional debonding processes can pose some challenges. Photonic debonding is an innovative debonding process utilizing a carrier coated with an inorganic metal release layer that aids in the release of the thinned wafer from the carrier substrate with no force and no damage to the delicate wafer upon activation of the release layer... » read more

An Efficient, Cost-Effective, Continuous Polymer Purification Method
By Brewer Science - 18 Jan, 2024 - Comments: 0

Polymer precipitation is a crucial process in chemical engineering and is widely applicable to many industries including semiconductors, pharmaceuticals, and wastewater treatment. In many industries, batch polymer precipitation is a common technique for polymer purification. However, batch polymer precipitation is an arduous and inefficient process, which generates excess solvent waste. It is l... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

IC Manufacturing Targets Less Water, Less Waste
By Anne Meixner - 16 Nov, 2023 - Comments: 0

Fabs, OSATs, and equipment makers are accelerating their efforts to consume less water while recycling more material waste in a trend toward better sustainability. With chips, sustainability is heavily focused on carbon emissions, and energy consumption is a significant contributor. But there is an equal effort underway to reduce water consumption and pollution. Across the globe, the number ... » read more

Gearing Up For Hybrid Bonding
By Laura Peters - 23 Oct, 2023 - Comments: 2

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets vertically in direct wafer-to-wafer bonds, chipmakers can leapfrog attainable interconnection pitch from 35µm in copper micro-bumps to 10µm or less. That reduces signal delay to negligible levels and e... » read more

Negative-Tone Photosensitive Polymeric Bonding Material To Enable Room Temperature Prebond For Cu/Polymer Hybrid Bonding
By Brewer Science - 18 Oct, 2023 - Comments: 0

An evaluation of a negative-tone i-line photosensitive polymeric bonding material for achieving prebonding in Cu/polymer hybrid bonding at low temperatures via the Cu damascene process. The polymeric material has a Tg≤100∘C ; Young’s modulus of 99 MPa, the dielectric constant of 2.6, and dissipation factor of 0.0016 at 10 GHz. Shear tests revealed a bond shear strength of over 10 MPa when... » read more

Building Better Bridges In Advanced Packaging
By Laura Peters - 21 Sep, 2023 - Comments: 1

The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced packaging. And while that opens up a slew of new options, it also is causing widespread confusion over what works best for different processes and technologies. At its core, advanced packaging depends on reliable interconnects, well-def... » read more

5 Reasons Why Defect Reduction Is Critical In Semiconductor Material Success
By Jessica Albright - 21 Sep, 2023 - Comments: 0

Semiconductors may be small, but the impacts they have are significant. Semiconductors used in life-dependent applications, such as pacemakers, defibrillators, life support systems, automotive safety systems, or in aviation need to be fail-proof. A device smaller than a centimeter with features just a few nanometers has no margin of error. This blog shares why it’s important to detect materia... » read more

Functionalized Carbon Nanotubes Enabled Flexible And Scalable CO2 Sensors
By Brewer Science - 21 Sep, 2023 - Comments: 0

This work, we have demonstrated a low-cost and effective chemiresistive CO2 sensor based on a composite of functionalized carbon nanotubes (f-CNTs) with polyethyleneimine (PEI). The resulting sensor shows excellent selectivity and sensitivity, which can respond to the CO2 concentration in a wide range of 300 - 5000 ppm. The effects of ink dilution and humidity from the environment on the sen... » read more

Chip Industry Week In Review
By The SE Staff - 15 Sep, 2023 - Comments: 0

By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

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