tag: Broadcom

The Road To 5nm
By Ed Sperling - 23 Jun, 2016 - Comments: 1

There is strong likelihood that enough companies will move to 7nm to warrant the investment. How many will move forward to 5nm is far less certain. Part of the reason for this uncertainty is big-company consolidation. There are simply fewer customers left who can afford to build chips at the most advanced nodes. Intel bought Altera. Avago bought Broadcom. NXP bought Freescale. GlobalFoundrie... » read more

Waiting For 5G Technology
By Mark LaPedus - 23 Jun, 2016 - Comments: 1

For some time, carriers, equipment OEMs and chipmakers have been gearing up for the next-generation wireless standard called 5th generation mobile networks, or 5G. 5G is the follow-on to the current wireless standard known as 4G, or long-term evolution (LTE). It will enable data transmission rates of more than 10Gbps, or 100 times the throughput of LTE. But the big question is whether 5G wil... » read more

Formal Confusion
By Brian Bailey - 07 Jun, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss the right and wrong ways to apply formal verification technology with Normando Montecillo, associate technical director at [getentity id="22649" comment="Broadcom"]; Ashish Darbari, principal engineer at [getentity id="22709" e_name="Imagination Technologies"]; Roger Sabbagh, principal engineer at Huawei; and Stuart Hoad, lead engineer at PMC Sierra... » read more

Formal Confusion
By Brian Bailey - 26 May, 2016 - Comments: 0

Formal verification has come a long way in the past five years. Tool developers changed direction and started to create self-contained apps which have led to a rapid proliferation of the technology. But formal is a diverse set of tools that can solve a variety of problems in the verification space and this has created a different kind of confusion within the industry. To find out how the indust... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 May, 2016 - Comments: 0

Chipmakers IC Insights released its top chip makers in terms of sales for the first quarter of 2016. The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and six fabless companies. Intel remained in the top spot, followed in order by Samsung and TSMC. The biggest movers in the ranking were made by the new Broadcom (Avago/Broadcom) and Nvidia. Broadcom jumped f... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Apr, 2016 - Comments: 0

Chipmakers IC Insights released its foundry rankings in terms of sales in 2015. TSMC was the leader with $26.4 billion in sales last year. Second ranked GlobalFoundries, which took over IBM’s IC business in 2015, made some gains. With IBM’s chip unit, GlobalFoundries’ quarterly sales in 4Q ‘15 were about $1.4 billion, an annual run-rate of $5.6 billion, about 12% greater than the compa... » read more

A Formal Transformation
By Brian Bailey - 24 Mar, 2016 - Comments: 0

A very important change is underway in functional verification. In the past, this was an esoteric technology and one that was difficult to deploy. It was relegated to tough problems late in the verification cycle, and it was difficult to justify the ROI unless the technology actually did find some problems. But all of that has changed. Formal verification companies started to use the technology... » read more

Why Power Modeling Is So Difficult
By Ed Sperling - 15 Feb, 2016 - Comments: 2

Power modeling has been talked about for years and promoted by EDA vendors and chipmakers as an increasingly important tool for advanced designs. But unlike hardware and software modeling, which have been proven to speed time to market for multiple generations of silicon, power modeling has some unique problems that are more difficult to solve. Despite continued development in this field, po... » read more

Why Use A Package?
By Ed Sperling - 21 Jan, 2016 - Comments: 0

Subramanian Iyer, distinguished chancellor's professor in UCLA's Electrical Engineering Department—and a former fellow and director of the systems scaling technology department at IBM—sat down with Semiconductor Engineering to talk about the future of chip scaling. What follows are excerpts of that conversation. SE: Advanced packaging is being viewed as a way to extend scaling in the fut... » read more

CEO Outlook: 2016
By Ed Sperling - 04 Jan, 2016 - Comments: 1

Semiconductor Engineering talked with 10 CEOs from all sides of the Semiconductor Industry for a high-level view of what to expect this year—good and bad. What follows are excerpts of those conversations, which were compiled over the past month. Scott McGregor, president and CEO of Broadcom "We're going to see more M&A. In the past, you only did deals that made sense strategically or ... » read more

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