tag: Broadcom

Why Power Modeling Is So Difficult
By Ed Sperling - 15 Feb, 2016 - Comments: 2

Power modeling has been talked about for years and promoted by EDA vendors and chipmakers as an increasingly important tool for advanced designs. But unlike hardware and software modeling, which have been proven to speed time to market for multiple generations of silicon, power modeling has some unique problems that are more difficult to solve. Despite continued development in this field, po... » read more

Why Use A Package?
By Ed Sperling - 21 Jan, 2016 - Comments: 0

Subramanian Iyer, distinguished chancellor's professor in UCLA's Electrical Engineering Department—and a former fellow and director of the systems scaling technology department at IBM—sat down with Semiconductor Engineering to talk about the future of chip scaling. What follows are excerpts of that conversation. SE: Advanced packaging is being viewed as a way to extend scaling in the fut... » read more

CEO Outlook: 2016
By Ed Sperling - 04 Jan, 2016 - Comments: 1

Semiconductor Engineering talked with 10 CEOs from all sides of the Semiconductor Industry for a high-level view of what to expect this year—good and bad. What follows are excerpts of those conversations, which were compiled over the past month. Scott McGregor, president and CEO of Broadcom "We're going to see more M&A. In the past, you only did deals that made sense strategically or ... » read more

Consolidation’s Aftermath
By Ed Sperling - 02 Dec, 2015 - Comments: 4

The recent spate of industry consolidation continues to have repercussions across the semiconductor industry. Some of those effects will subside once the deals are either approved or nixed by regulatory agencies. Others will raise questions for months or years to come. Consolidation is not a new trend in the semiconductor industry, but the pace and size of the acquisitions in the past year a... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Nov, 2015 - Comments: 0

IC Insights released its preliminary top IC rankings in terms of sales for 2015. In the rankings, Intel remains in first place in terms of chip sales in 2015, followed by Samsung and TSMC. GlobalFoundries and UMC also moved up in the rankings. Beyond that, the market is in flux. “The pending mergers of Avago and Broadcom and NXP and Freescale will have a significant impact on future top-20 ra... » read more

Security Improvements Ahead
By Ed Sperling - 10 Nov, 2015 - Comments: 0

After nearly two years of talking about how security is one of the biggest problems facing the IoE, progress is being made on a number of fronts. The changes involve many companies, both individually and collaboratively through standards groups. And while none of this will stop the kind of high-profile breaches that affected Target or Home Depot or JPMorgan Chase or a long list of other gian... » read more

The Great IoE Race Begins
By Ed Sperling - 05 Nov, 2015 - Comments: 0

Nobody knows how many tens of billions of semiconductors will be used in the IoE, but it's a sure bet it won't be a few chips replicated billions of times. Most IoE devices will need to be customized for specific applications. Many will need to be highly reliable for many years. And all of them will need to be secure and power-efficient. Yet they also will need to connect to heterogeneous ne... » read more

The New Face of Formal
By Brian Bailey - 04 Nov, 2015 - Comments: 0

Semiconductor engineering sat down to discuss the recent growth in adoption of formal technologies and tools with Lawrence Loh, product engineering group director at [getentity id="22032" e_name="Cadence"], Praveen Tiwari, senior manager R&D, verification group at [getentity id="22035" e_name="Synopsys"], Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"], Normando... » read more

The New Face Of Formal
By Brian Bailey - 29 Oct, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss the recent growth in adoption of formal technologies and tools with Lawrence Loh, product engineering group director at [getentity id="22032" e_name="Cadence"], Praveen Tiwari, senior manager of R&D in the verification group at [getentity id="22035" e_name="Synopsys"], Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphic... » read more

Power Estimation: Early Warning System Or False Alarm?
By Brian Bailey - 02 Oct, 2015 - Comments: 0

Semiconductor Engineering sat down with a large panel of experts to discuss the state of power estimation and to find out if the current levels of accuracy are sufficient to being able to make informed decisions. Panelists included: Leah Schuth, director of technical marketing in the physical design group at [getentity id="22186" comment="ARM"]; Vic Kularni, senior vice president and general ma... » read more

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