tag: Broadcom

Power Shifts In Digital Chip Space
By Bhanu Kapoor - 08 Aug, 2013 - Comments: 0

By Bhanu Kapoor The power issue has been quite disrupting in the digital semiconductor space. The processor architecture shifted to parallel processing with the “power wall” stopping the frequency scaling that the industry had conveniently used in the last few decades. The power issue also is causing semiconductor process technology to change in ways other than simply scaling from one ... » read more

Experts At The Table: Low-Power Verification
By Ed Sperling - 08 Aug, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss power format changes with Sushma Hoonavera-Prasad, design engineer in Broadcom’s mobile platform group; John Biggs, consultant engineer for R&D and co-founder of ARM; Erich Marschner, product marketing manager at Mentor Graphics; Qi Wang, technical marketing group director at Cadence; and Jeffrey Lee, corporate app... » read more

The Week In Review: Aug 5
By Ed Sperling - 05 Aug, 2013 - Comments: 0

By Mark LaPedus According to a nationwide online survey conducted by Harris Interactive on behalf of Crucial.com, 36% of those Americans who experienced PC problems in the past six months admit they have lashed out at their slow, underperforming computers by using profanity, screaming and shouting, or by striking it with a fist or other object. Those who experienced computer problems also indi... » read more

Experts At The Table: The Trouble With Low-Power Verification
By Ed Sperling - 29 Mar, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss low-power verification with Leah Clark, associate technical director at Broadcom; Erich Marschner, product marketing manager at Mentor Graphics; Cary Chin, director of marketing for low-power solutions at Synopsys; and Venki Venkatesh, senior director of engineering at Atrenta. What follows are excerpts of that conversat... » read more

Continuous, Connected And Concurrent Verification
By Ed Sperling - 28 Mar, 2013 - Comments: 0

By Ed Sperling It’s a wonder that any electronic system works as intended, or that it continues to work months or years after it is sold. The reason: SoCs have become so complex that no verification coverage model is sufficient anymore, no methodology covers every aspect of verification, and no single tool or even collection of tools can catch every bug or prevent them from being there in th... » read more

Experts At The Table: The Trouble With Low-Power Verification
By Ed Sperling - 22 Mar, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss low-power verification with Leah Clark, associate technical director at Broadcom; Erich Marschner, product marketing manager at Mentor Graphics; Cary Chin, director of marketing for low-power solutions at Synopsys; and Venki Venkatesh, senior director of engineering at Atrenta. What follows are excerpts of that conversat... » read more

Moore’s Law 2.0
By Ed Sperling - 14 Mar, 2013 - Comments: 0

By Ed Sperling Doubling the number of transistors on a piece of silicon every 18 to 24 months used to be synonymous with engineering progress, but as the semiconductor world migrates from processors to SoCs the fundamental basis of Moore’s Law is losing its meaning. Even its famous timetable is slipping. For one thing, it’s simply too expensive and difficult to migrate from one node to ... » read more

Experts At The Table: The Trouble With Low-Power Verification
By Ed Sperling - 14 Mar, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss low-power verification with Leah Clark, associate technical director at Broadcom; Erich Marschner, product marketing manager at Mentor Graphics; Cary Chin, director of marketing for low-power solutions at Synopsys; and Venki Venkatesh, senior director of engineering at Atrenta. What follows are excerpts of that conversat... » read more

The Week In Review: Feb. 25
By Ed Sperling - 25 Feb, 2013 - Comments: 0

By Mark LaPedus Is China set to bail out a U.S. government technology darling? Two Chinese automotive companies, Geely and Dongfeng Motor, are reported to have bid between $200 million and $350 million for a majority stake in Fisker, the maker of plug-in hybrid cars. If that happens Fisker—which has $192 million in U.S. federal government loan guarantees—could be headed to China, according... » read more

Smartphones Dial Up New RF Processes
By Mark LaPedus - 24 Jan, 2013 - Comments: 0

By Mark LaPedus The rapid shift towards smartphones and tablets is driving the need for new and low-power chips at finer geometries. Today, the latest application processors, integrated basebands and other digital cell-phone chips are 28nm planar devices. And it won’t be long before OEMs incorporate 20nm planar and finFET devices in their systems as a means to reduce power and extend batt... » read more

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