tag: Broadcom

Week In Review: Design, Low Power
By Jesse Allen - 27 May, 2022 - Comments: 0

EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 27 May, 2022 - Comments: 0

Automotive, mobility Cadence is now an official technology partner of the McLaren Formula 1 Team. The team will use Cadence’s Fidelity CFD Software to look at the computational fluid dynamics (CFD) of the airflow around the race cars and predict how a car design will affect the airflow. Infineon uncorked its XENSIV 60 GHz automotive radar sensor for in-cabin monitoring systems. One use ca... » read more

Week In Review: Design, Low Power
By Jesse Allen - 15 Apr, 2022 - Comments: 0

Ansys will acquire cloud simulation provider OnScale. OnScale's technology will be used to provide a cloud-native, web-based UI for device-independent access to Ansys’ simulation technologies as well as creation of simulation-based vertical applications. “OnScale’s cloud-native technology combines the limitless compute power of cloud supercomputers with an intuitive web-based front end, m... » read more

Success Stories For Packetized Scan Data
By Geir Eide - 07 Dec, 2021 - Comments: 0

Some new design-for-test (DFT) technologies are difficult, expensive, or risky to implement but offer significant benefits. Other technologies are easy to implement but offer minor improvements. The calculation of whether (or when) to adopt new technology includes consideration of the pressures of DFT today—design complexity, the lack of flexibility in hardwiring scan channels, the proliferat... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 May, 2021 - Comments: 0

Government policy Semiconductor companies as well hardware and software vendors have announced the formation of the Semiconductors in America Coalition (SIAC). The group called on congressional leaders to appropriate $50 billion for U.S. manufacturing incentives and research initiatives. SIAC’s mission is to advance federal policies that promote semiconductor manufacturing and research in th... » read more

Chasing Test Escapes In IC Manufacturing
By Anne Meixner - 11 May, 2021 - Comments: 0

The number of bad chips that slip through testing and end up in the field can be significantly reduced before those devices ever leave the fab, but the cost of developing the necessary tests and analyzing the data has sharply limited adoption. Determining an acceptable test escape metric for an IC is essential to improving the yield-to-quality ratio in chip manufacturing, but what exactly is... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Apr, 2021 - Comments: 0

Government policy At one point, there was a school of thought that the Biden administration would relax the current tariffs and export controls in regards to China. So far, the Biden administration hasn’t changed any of the previous policies and is doubling down on those efforts. The Department of Commerce’s Bureau of Industry and Security (BIS) this week added seven Chinese supercomput... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 12 Feb, 2021 - Comments: 0

Automotive/Mobility With the chip supply so tight it is shutting down automotive production lines, U.S. chip company CEOs signed a Semiconductor Industry Association (SIA) letter asking the U.S. president to include funding incentives for the chip manufacturing in U.S. economic recovery plans. The letter references the CHIPS for America Act and asks the president to work with Congress to suppo... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Dec, 2020 - Comments: 0

Government and trade The U.S. Bureau of Industry and Security (BIS) has expanded its export control regulations for U.S.-based hi-tech companies. The BIS has added more companies to its “Military End User” (MEU) list. The list involves 103 entities, which includes 58 Chinese and 45 Russian companies. The U.S. government has determined that these companies are “military end users” or th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Dec, 2020 - Comments: 0

Packaging and EMS ASE is expanding its efforts in the electronic manufacturing services (EMS) business. Universal Scientific Industrial (USI), a subsidiary of ASE, has completed the acquisition of Asteelflash Group through the acquisition of its parent company, Financière. USI provides electronic design and manufacturing services. It also provides system-in-package (SiP) modules. Asteelfla... » read more

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