tag: Broadcom

Challenges For A Post-Moore’s Law World
By Ed Sperling - 27 Jul, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss challenges at the edge, the impact of open-source, and how to attract new talent, with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The con... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Jul, 2020 - Comments: 0

Market research After years of falling demand, the PC market is back. The second quarter of 2020 ended well for the traditional PC market, including desktops, notebooks, and workstations. Global PC shipments jumped 11.2% year-over-year reaching a total of 72.3 million units, according to IDC. As restrictions around the world tightened in the first few weeks of the quarter, demand for notebo... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Jun, 2020 - Comments: 0

Fast Arm-based supercomputer Japan has taken the lead in the supercomputer race, jumping ahead of the U.S. But China continues to make its presence felt in the arena. Fugaku, an ARM-based supercomputer jointly developed by Japan’s Riken and Fujitsu, is now ranked the world’s fastest supercomputer in the 55th TOP500 list. Fugaku turned in a high performance Linpack (HPL) result of 415.5... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 03 Apr, 2020 - Comments: 0

Synopsys has added nanoscale and macroscale illumination optics to its RSoft Photonic Device Tools version 2020.03. ARVR designers can use the RSoft-LightTools Bidirectional Scattering Distribution Function (BSDF) interface to make interpolated BSDF files for optimized nanoscale and macroscale optics, such as freeform optical prism projectors, eye tracking technologies, and optical planar waveg... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Mar, 2020 - Comments: 0

Fab tools, materials and packaging Intel has recognized 37 companies for its annual suppliers’ awards. The list includes equipment, materials, packaging houses and other segments. These suppliers have collaborated with Intel to implement process improvements with good products and services. See who made the list here. ---------------------------------------- Lam Research has introduced... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 14 Feb, 2020 - Comments: 0

AI/Edge Arm putting AI (artificial intelligence) and machine learning (ML) on the Cortex-M processor by offering IP for a microNPU for Cortex-M. The company says in a press release that it will deliver a 480x uplift in ML performance. The new Cortex-M IP is Arm Ethos-U55 NPU, which Arm says is the industry’s first microNPU (neural processing unit). Arm is hoping the new IP will start an expl... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Jan, 2020 - Comments: 0

Coronavirus The coronavirus in China has been declared as a global health emergency by the World Health Organization (WHO). The situation appears to be much worse than SARS (severe acute respiratory syndrome), which hit in 2003. Several companies are taking precautionary measures to prevent widespread transmission of coronavirus. For example, ASE has devoted a Web page for the measures it is t... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 31 Jan, 2020 - Comments: 0

AI/Edge Brewer Science is introducing its first material for permanent bond used in assembling ICs, image sensor devices, and MEMS for devices and packaging that “include low-temperature bonding, extreme chemical resistance, UV or thermal curable bonding process, and no material movement after cure,” according to a press release. The bond is part of the PermaSOL product family. “These hi... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Jan, 2020 - Comments: 0

Inphi Corporation and Synopsys finalized the acquisition of eSilicon. Synopsys acquired certain IP assets from eSilicon, including TCAMs and multi-port memory compilers, as well as its Interface IP portfolio with High-Bandwidth Interface (HBI) IP and a team of R&D engineers; it did not disclose terms of the deal. Inphi Corporation bought the rest of the company for approximately $216 millio... » read more

Week In Review: IoT, Security, Autos
By Susan Rambo - 17 Jan, 2020 - Comments: 0

The United States signed trade agreements with the China (phase one agreement) and North American countries Mexico and Canada this week. The SIA (Semiconductor Industry Association), which represents the U.S. semiconductor industry, applauded the agreements. Still to be worked out is the second part, or phase two, of the U.S.’s agreement with China. AI/Edge M&A Apple is acquiring edge... » read more

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