Power, Performance — Avionics Designers Want It All


Not long ago, the prevailing philosophy among chip designers for aviation systems could be summed up as, “I feel the need — the need for speed.” Today, aviation’s top guns have pulled back on the throttle a bit. There’s a more nuanced discussion balancing the need for performance versus power, with other factors coming into consideration such as safety, security certifications and ove... » read more

Accelerate Adoption Of High-Speed, Low-Latency, Cache-Coherent Standards Using Formal Verification


We continue to see huge growth in data and compute demand, fueled by increased global data traffic with the 5G rollout, the prevalence of streaming services, and expanded artificial intelligence and machine learning (AI/ML) applications. Several new industry-standard specifications have emerged in recent years to define the protocols of the underlying electronic components and IP building block... » read more

Reliability Costs Becoming Harder To Track


Ensuring reliability in chips is becoming more complex and significantly more expensive, shifting left into the design cycle and right into the field. But those costs also are becoming more difficult to define and track, varying greatly from one design to the next based upon process node, package technology, market segment, and which fab or OSAT is used. As the number of options increases fo... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — IoT, edge, cloud, data center, and back To simplify IoT workflows, Arm announced that it is putting parts of its Common Microcontroller Software Interface Standard (CMSIS) into an open project called Open-CMSIS-Pack. The CMSIS is a vendor-independent abstraction layer for MCUs, especially Arm Cortex-M processors, that makes it possible for developers to deal with softwa... » read more

Big Changes Ahead For Connected Vehicles


Carmakers are reworking their electronic architectures so they can tap into a growing number of external services and internal options, similar to the way a data center taps into various services over its internal network. In the past, this has been largely confined to internal services such as on-board Internet connectivity, and external traffic routing and music. The current vision is to g... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — IoT, edge, cloud, data center, and back Cadence announced it has found a cost-conscience way to scale capacity for 3D electromagnetic (EM) simulations using a hybrid cloud consisting of local computing resources and cloud services from Amazon Web Service (AWS). Data stays safe on the local resources, and, if more computing resources are needed, encrypted simulation-spec... » read more

Virtuoso ADE Assembler


Cadence Virtuoso ADE Assembler is an advanced design and simulation environment that extends the capabilities of Virtuoso ADE Explorer, adding all the tests needed to fully verify a design over all operational, process, and environmental conditions. As more analysis is required, users can take incremental advantage of the Virtuoso Variation Option to do more advanced statistical analysis on the... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — IoT, edge, cloud, data center, and back Combining AI with IoT not only gives another acronym AIoT, or Artificial Intelligence of Things, but it puts AI systems on the edge. Infineon Technologies has released its ModusToolbox Machine Learning to make it possible to run deep learning-based workloads on Infineon’s PSoC microcontrollers. The toolbox has middleware, softwa... » read more

11 Ways To Reduce AI Energy Consumption


As the machine-learning industry evolves, the focus has expanded from merely solving the problem to solving the problem better. “Better” often has meant accuracy or speed, but as data-center energy budgets explode and machine learning moves to the edge, energy consumption has taken its place alongside accuracy and speed as a critical issue. There are a number of approaches to neural netw... » read more

Mapping Heat Across A System


Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

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