tag: Cadence Design Systems

Modified X-Band Push-Push Oscillator Simulation And Measurement
By Cadence - 11 Nov, 2020 - Comments: 0

This eBook that explores the push-push oscillator configuration via harmonic balance (HB) computer simulation and test measurement. The unique operation of the push-push oscillator configuration is explored using HB simulation of spectral content and time-domain voltage waveforms. Dynamic load lines are investigated and utilized to explore peak signal excursion and degree of nonlinearity. Predi... » read more

New And Innovative Supply Chain Threats Emerging
By Bryon Moyer - 05 Nov, 2020 - Comments: 1

The electronics supply chain is seeing evidence of increased sophistication in the counterfeiting of complex ICs and simple passives, both of which can impact the functioning and safety of the systems that use them. New technologies are being developed to build trust by helping to identify counterfeit devices before assembly and during failure analysis. It's too early to tell how effective t... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 30 Oct, 2020 - Comments: 0

Automotive Synopsys added support for Infineon's automotive AI chip, the AURIX TC4xx 32-bit microcontroller with parallel processing unit. Dialog Semiconductor announced automotive qualification for its DA7280 high-definition haptic driver. The company Alps Alpine is using the DA7280 in Alps Alpine Heavy, the latest version of its HAPTIC Reactor Linear Resonant Actuators (LRAs). Bosch, M... » read more

Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver
By Cadence - 28 Oct, 2020 - Comments: 0

Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and FDTD), due to the complexity in the 3D designs.... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 16 Oct, 2020 - Comments: 0

Security Intel announced new security features for its code-named Ice Lake CPU, according to a story in SecurityWeek. The 10nm-based Xeon Scalable will have SGX trusted execution environment and several new features for memory encryption, firmware resilience, and cryptographic performance acceleration. The new Total Memory Encryption (TME) feature in the CPU will encrypt access to memory. S... » read more

Slower Metal Bogs Down SoC Performance
By Bryon Moyer - 15 Oct, 2020 - Comments: 0

Metal interconnect delays are rising, offsetting some of the gains from faster transistors at each successive process node. Older architectures were born in a time when compute time was the limiter. But with interconnects increasingly viewed as the limiter on advanced nodes, there’s an opportunity to rethink how we build systems-on-chips (SoCs). ”Interconnect delay is a fundamental tr... » read more

Searching For Power Bugs
By Brian Bailey - 15 Oct, 2020 - Comments: 0

How much power is your design meant to consume while performing a particular function? For many designs, getting this right may separate success from failure, but knowing that right number is not as easy as it sounds. Significant gaps remain between what power analysis may predict and what silicon consumes. As fast as known gaps are closed, new challenges and demands are being placed on the ... » read more

Confusion Grows Over Packaging And Scaling
By Ann Mutschler - 15 Oct, 2020 - Comments: 0

The push toward both multi-chip packaging and continued scaling of digital logic is creating confusion about how to classify designs, what design tools work best, and how to best improve productivity and meet design objectives. While the goals of design teams remains the same — better performance, lower power, lower cost — the choices often involve tradeoffs between design budgets and ho... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 09 Oct, 2020 - Comments: 0

Security A new certification program for hardware verification engineers from Edaptive Computing Inc (ECI) and OneSpin Solutions promises to help companies meet IC integrity standards for SoC designs for 5G, IoT, AI, automotive, industrial, defense, and avionics. These designs are often complex, with a variety of elements, such as programmable logic and different cores. The OneSpin Formal Veri... » read more

Sensor Fusion Challenges In Cars
By Ann Mutschler - 08 Oct, 2020 - Comments: 0

The automotive industry is zeroing in on sensor fusion as the best option for dealing with the complexity and reliability needed for increasingly autonomous vehicles, setting the stage for yet another shift in how data from multiple devices is managed and utilized inside a vehicle. The move toward greater autonomy has proved significantly more complicated than anyone expected at first. There... » read more

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