ISO 26262’s Importance Widens Beyond Automotive


The ISO 26262 standard, which has become a mainstay since the trend toward vehicle electrification really took root a decade ago, is starting to gain traction in markets outside of automotive chip and system design. At the center of this expansion is a focus on safety under a variety of conditions — extreme temperatures, unexpected vibration, or a collision that is unavoidable. This includ... » read more

10 CFD Simulations To Try Out This Winter


As winter settles in and the snowflakes begin to fall, it's time to dust off those curious minds and prepare for some seriously fun—and slightly nerdy—computational fluid dynamics (CFD) simulations! Whether you’re a CFD expert or a beginner looking for scientific flair, here are ten simulations that will warm your winter spirit and challenge your brain cells. Snowflake dynamics: N... » read more

Fully Coupled CFD Simulations for Micro Gas Turbine Engines


This conference paper offers a detailed exploration of the fully coupled CFD simulation of a KJ66 micro gas turbine (MGT) engine—an innovative approach that enhances the accuracy and fidelity of 3D numerical analysis. Key Takeaways: Integrated Approach: Unlike traditional component-by-component analysis, fully coupled simulations account for the interactions between the compressor, co... » read more

Blog Review: Jan. 8


Cadence's Igor Krause unravels the different Orthogonal Header Content (OHC) types in PCIe 6.0, which work as an extra header for the Transaction Layer Packet (TLP) that incorporates information fields that are needed depending on the TLP type. Siemens EDA's Yunhong Min considers how AI and machine learning are reshaping functional verification workflows from translating specifications to de... » read more

Auto Ecosystem Begins Shift To Software-First


Experts at the Table: The automotive ecosystem is in the midst of an intense evolution as OEMs and tiered providers grapple with how to deal with legacy technology while incorporating ever-increasing levels of autonomy, electrification, and software-defined vehicle concepts. Semiconductor Engineering sat down to discuss these and other related issues with Wayne Lyons, senior director for the au... » read more

Introduction Of High Bandwidth Embedded USB2v2 (eUSB2v2) Standard


Universal Serial Bus (USB) technology is the most popular connector in every computing device, but when it comes to embedded applications, where only a specific device function may be required, the architectural philosophy of the USB technology becomes inefficient. One example could be USB cameras. With increasing user expectations of camera resolution and frame rates, the bandwidth constrai... » read more

Strain, Stress In Advanced Packages Drives New Design Approaches


Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, dependencies, and interactions, and driving demand for new tools. Unlike in the past, when various components were crammed into a planar SoC on a relatively thick substrate, the new substrates are bei... » read more

Improving Verification Performance


Without methodology improvements, verification teams would not be able keep up with the growing complexity and breadth of the tasks assigned to them. Tools alone will not provide the answer. The magnitude of the verification task continues to outpace the tools, forcing design teams to seek out better ways to intermix and utilize the tools that are available. But as verification teams take on... » read more

Blog Review: Dec. 18


Siemens’ Michael Munsey predicts that the convergence of AI, advanced packaging, and rise of software-defined products aren’t just incremental changes but will represent a fundamental shift in how we think about semiconductor design and manufacturing. Cadence's Veena Parthan points to hex-core voxels as a significant leap forward for the CFD meshing process that blends the best of struct... » read more

Chip Industry Week In Review


The 2024 IEEE International Electron Devices Meeting (IEDM) was held this week, prompting a number of announcements from: imec: Proposed a new CFET-based standard cell architecture for the A7 node containing two rows of CFETs with a shared signal routing wall in between, allowing standard cell heights to be reduced from 4 to 3.5T, compared to single-row CFETs. Integrated indium pho... » read more

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