tag: Caltech

Chip Industry Technical Paper Roundup: Nov. 11
By Linda Christensen - 11 Nov, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=381 /] More Reading Technical Paper Library » read more

New Class Of Materials With Increased Band Gap (U. of Minnesota, Caltech)
By Technical Paper Link - 08 Nov, 2024 - Comments: 0

A new technical paper titled "Deep-ultraviolet transparent conducting SrSnO3 via heterostructure design" was published by researchers at University of Minnesota–Twin Cities and Caltech. The researchers "looked at creating a new class of materials with increased “band gap,” enhancing both transparency and conductivity. The new material is a transparent conducting oxide, created with a s... » read more

Chip Industry Week In Review
By The SE Staff - 11 Oct, 2024 - Comments: 0

Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

Chip Industry Week In Review
By The SE Staff - 04 Oct, 2024 - Comments: 0

Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Chip Industry Week in Review
By The SE Staff - 30 Aug, 2024 - Comments: 1

The Biden-Harris Administration announced preliminary terms with HP for $50 million in direct funding under the CHIPs and Science Act to support the expansion and modernization of HP’s existing microfluidics and microelectromechanical systems (“MEMS”) facility in Corvallis, Oregon. CHIPS for America launched the CHIPS Metrology Community, a collaborative initiative designed to advance ... » read more

Chip Industry Week In Review
By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Chip Industry Technical Paper Roundup: June 18
By Linda Christensen - 18 Jun, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=234 /] More ReadingTechnical Paper Library home » read more

KAN: Kolmogorov Arnold Networks: An Alternative To MLPs (MIT, CalTech, et al.)
By Technical Paper Link - 13 Jun, 2024 - Comments: 0

A new technical paper titled "KAN: Kolmogorov-Arnold Networks" was published by researchers at MIT, CalTech, Northeastern University and The NSF Institute for Artificial Intelligence and Fundamental Interactions. Abstract: "Inspired by the Kolmogorov-Arnold representation theorem, we propose Kolmogorov-Arnold Networks (KANs) as promising alternatives to Multi-Layer Perceptrons (MLPs). While... » read more

Chip Industry Week In Review
By The SE Staff - 17 May, 2024 - Comments: 0

President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used. Intel ... » read more

Running More Efficient AI/ML Code With Neuromorphic Engines
By Karen Heyman - 16 May, 2024 - Comments: 0

Neuromorphic engineering is finally getting closer to market reality, propelled by the AI/ML-driven need for low-power, high-performance solutions. Whether current initiatives result in true neuromorphic devices, or whether devices will be inspired by neuromorphic concepts, remains to be seen. But academic and industry researchers continue to experiment in the hopes of achieving significant ... » read more

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