Unveiling the Stability of Proper Polyethyleneimine-Functionalized Carbon Nanotube Composites-Derived Chemiresistive CO2 Sensors

By Brewer Science - 24 Oct, 2024 - Comments: 0

A technical paper titled "Unveiling the Stability of Proper Polyethyleneimine-Functionalized Carbon Nanotube Composites-Derived Chemiresistive CO2 Sensors" was published by researchers at Brewer Science. Abstract "Branched polyethyleneimine (PEI), consisting of numerous imine groups, is employed for CO2 gas detection, attributed to the interaction between imine groups and CO2. Incorporatin... » read more

Ultrafast Charge Transfer Cascade In Semiconductor Materials

By Technical Paper Link - 27 Jul, 2024 - Comments: 0

A technical paper titled “Ultrafast Charge Transfer Cascade in a Mixed-Dimensionality Nanoscale Trilayer” was published by researchers at the National Renewable Energy Laboratory. Abstract: "Innovation in optoelectronic semiconductor devices is driven by a fundamental understanding of how to move charges and/or excitons (electron-hole pairs) in specified directions for doing useful work, ... » read more

Functionalized Carbon Nanotubes Enabled Flexible And Scalable CO2 Sensors

By Brewer Science - 21 Sep, 2023 - Comments: 0

This work, we have demonstrated a low-cost and effective chemiresistive CO2 sensor based on a composite of functionalized carbon nanotubes (f-CNTs) with polyethyleneimine (PEI). The resulting sensor shows excellent selectivity and sensitivity, which can respond to the CO2 concentration in a wide range of 300 - 5000 ppm. The effects of ink dilution and humidity from the environment on the sen... » read more

Why Countermeasures Are Needed To Prevent Practical, Non-Invasive Attacks Against CNT-PUFs

By Technical Paper Link - 08 Jul, 2023 - Comments: 0

A technical paper titled "Practical Non-Invasive Probing Attacks Against Novel Carbon-Nanotube-Based Physical Unclonable Functions" was published by researchers at University of Passau, Chemnitz University of Technology, Fraunhofer Institute for Electronic Nano Systems, and Technical University of Darmstad. Abstract: "As the number of devices being interconnected increases, so does also the d... » read more

Manufacturing Bits: Oct. 12

By Mark LaPedus - 12 Oct, 2020 - Comments: 1

MoSi2 pellicles for EUV Hanyang University has presented a paper that describes a novel molybdenum disilicide (MoSi2) pellicle membrane for use in extreme ultraviolet (EUV) lithography. With a 28nm thickness, a MoSi2 membrane has demonstrated a 89.33% transmittance for EUV lithography. The pellicle technology is still in R&D. MoSi2, which is a silicide of molybdenum, is a refractory cer... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: carbon nanotube

Unveiling the Stability of Proper Polyethyleneimine-Functionalized Carbon Nanotube Composites-Derived Chemiresistive CO2 Sensors

Ultrafast Charge Transfer Cascade In Semiconductor Materials

Functionalized Carbon Nanotubes Enabled Flexible And Scalable CO2 Sensors

Why Countermeasures Are Needed To Prevent Practical, Non-Invasive Attacks Against CNT-PUFs

Manufacturing Bits: Oct. 12