Latency, Interconnects, And Poker


Semiconductor Engineering sat down with Larry Pileggi, Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University, and the winner of this year's Phil Kaufman Award for Pioneering Contributions. What follows are excerpts of that conversation. SE: When did you first get started working in semiconductors — and particularly, EDA? Pileggi: This w... » read more

Chip Industry Talent Shortage Drives Academic Partnerships


Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Technical Paper Roundup: Sept 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=136 /] (more…) » read more

An Eco-Friendly Conductive Ink For Thin-Film Electronics


A technical paper titled “Recyclable Thin-Film Soft Electronics for Smart Packaging and E-Skins” was published by researchers at Carnegie Mellon University and University of Coimbra. Abstract: Despite advances in soft, sticker-like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco-friendly conductive ink for thin-film... » read more

Week In Review: Auto, Security, Pervasive Computing


Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

Week In Review: Auto, Security, Pervasive Computing


Joby Aviation and Alef Automotive each received a Special Airworthiness Certificate from the U.S. Federal Aviation Administration (FAA) for an electric vertical take-off and landing (eVTOL) aircraft. Joby will now begin flight testing the prototype, and the aircraft will move to Edwards Air Force Base in 2024 as part of a contract with the U.S. Air Force. Alef’s model is the first U.S. govern... » read more

Chip Industry’s Technical Paper Roundup: July 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

Self-Driving Cars: Formalization and Verification Of The Responsibility-Sensitive Safety (RSS) Model


A technical paper titled “Slow Down, Move Over: A Case Study in Formal Verification, Refinement, and Testing of the Responsibility-Sensitive Safety Model for Self-Driving Cars” was published by researchers at Carnegie Mellon University. Abstract: "Technology advances give us the hope of driving without human error, reducing vehicle emissions and simplifying an everyday task with the futur... » read more

Week In Review: Semiconductor Manufacturing, Test


The CHIPS for America team at the U.S. Department of Commerce named the selection committee who will select board members for the nonprofit entity that will likely be managing the National Semiconductor Technology Center (NSTC). Members include John Hennessy, chairman of Alphabet; Jason Matheny, president and CEO of the RAND Corporation; Don Rosenberg, fellow in residence at UCSD’s School of ... » read more

Chip Industry’s Technical Paper Roundup: Mar. 21


New technical papers recently added to Semiconductor Engineering’s library: [table id=88 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

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