tag: CEA-Leti

The Week In Review: Manufacturing
By Mark LaPedus - 17 Jul, 2015 - Comments: 0

Semicon West is always a busy week. Typically, there are a plethora of events going on during the week. It’s also a good week to get a pulse on the industry. The good news: Innovation is alive and well. Bad news: Intel cut its CapEx. And tool makers are in the midst of a lull right now, with a cloudy outlook projected for 2016. Some even see a dreaded downturn next year. Pacific Crest Secu... » read more

Moore’s Law Reset?
By Ed Sperling - 13 Jul, 2015 - Comments: 0

GlobalFoundries today took the wraps off its 22nm FD-SOI process, promising to extend Moore's Law technologically without altering the economic equation—at least for the next couple of process nodes. Subramani Kengeri, vice president of global design solutions at [getentity id="22819" comment="GlobalFoundries"], said 22nm FD-SOI will provide the same 30% improvement in PPA that has been c... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Jul, 2015 - Comments: 0

An alliance led by IBM Research has produced the semiconductor industry’s first 7nm test chips with functioning transistors. The breakthrough, accomplished in partnership with GlobalFoundries and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering, could result in the ability to place more than 20 billion tiny switches, or transistors, on a chip. There i... » read more

Manufacturing Bits: July 7
By Mark LaPedus - 07 Jul, 2015 - Comments: 0

Silicon photonics prototyping A group of European and other research organizations have put the finishing touches on a project to help propel the development of silicon photonics into the commercial market. The project, dubbed ESSenTIAL, enables small- to mid-sized enterprises to develop prototypes and products based on silicon photonics. Funded by the European Commission, the project inclu... » read more

Foundries Expand Planar Efforts
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

Manufacturing Bits: June 16
By Mark LaPedus - 16 Jun, 2015 - Comments: 0

Harmonic EUV The U.S. Department of Energy’s Lawrence Berkeley National Laboratory has devised an efficient extreme ultraviolet (EUV) source. The technology could one day be used for a new class of metrology tools, based on angle-resolved photoemission spectroscopy (ARPES). This technique makes use of a photoelectric effect for studying materials. To enable the source, Berkeley Labs devel... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Jun, 2015 - Comments: 0

Christopher Rolland, an analyst at FBR, made a startling statement in a recent report. “At the pace of consolidation set thus far this year, 32% of all U.S. publicly traded semiconductor companies would be acquired in 2015! While this run-rate is not likely sustainable and should slow as the year progresses, we still expect ~15% consolidation rates for the remainder of this cycle (above low-t... » read more

Semiconductor R&D Crisis?
By Mark LaPedus - 11 Jun, 2015 - Comments: 3

Research and development is a sometimes forgotten but critical element in the semiconductor industry. The delicate R&D ecosystem enables many of the key breakthroughs in the business. But there could be a troubling trend, if not a crisis, brewing on two fronts in the R&D arena. On one front, R&D costs for semiconductor technologies are escalating at each node. Higher R&D costs are not only ... » read more

Manufacturing Bits: March 31
By Mark LaPedus - 31 Mar, 2015 - Comments: 0

Shish kebab nano necklaces Using a directed self-assembly (DSA) process, Georgia Institute of Technology has developed a method to make nanometer-scale, chip-based necklaces. The technique could enable organic-inorganic structures, which resemble a tiny shish kebab or a centipede. The structures are made with various materials, such as semiconductors, magnetics, ferroelectrics and others. ... » read more

Manufacturing Bits: March 17
By Mark LaPedus - 17 Mar, 2015 - Comments: 0

EUV source firm seeks help In 2012, a startup called Zplasma came out of stealth mode and introduced its first technology—a next-generation power source for extreme ultraviolet (EUV) lithography. But after much fanfare and hope, Zplasma has been unable to commercialize its EUV source technology. The company has also been unable to attract a development partner or outside funding. And t... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy