Chip Industry Week In Review

By The SE Staff - 01 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

Chip Industry Week In Review

By The SE Staff - 23 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Intel officially launched Intel Foundry this week, claiming it's the "world's first systems foundry for the AI era." The foundry also showed off a more detailed technology roadmap down to expanded 14A process technology. Intel CEO Pat Gelsinger noted the foundry will be separate from the chipmaker, utilize third-party chiplets and IP, and leverage... » read more

Building CFETs With Monolithic And Sequential 3D

By Katherine Derbyshire - 22 Feb, 2024 - Comments: 0

Successive versions of vertical transistors are emerging as the likely successor to finFETs, combining lower leakage with significant area reduction. A stacked nanosheet transistor, introduced at N3, uses multiple channel layers to maintain the overall channel length and necessary drive current while continuing to reduce the standard cell footprint. The follow-on technology, the CFET, pushes... » read more

Chip Industry Technical Paper Roundup: Feb. 13

By Liz Allan - 13 Feb, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=197 /] More ReadingTechnical Paper Library home » read more

Benchmarking Electron Holography And Pixelated STEM On Various Semiconductor Structures

By Technical Paper Link - 06 Feb, 2024 - Comments: 0

A technical paper titled “Measuring electrical properties in semiconductor devices by pixelated STEM and off-axis electron holography (or convergent beams vs. plane waves).” was published by researchers at CEA-LETI at the Universite Grenoble Alpes and EPFL. Abstract: "We demonstrate the use of both pixelated differential phase contrast (DPC) scanning transmission electron microscopy (STEM... » read more

Research Bits: Jan. 23

By Jesse Allen - 23 Jan, 2024 - Comments: 0

Memristor-based Bayesian neural network Researchers from CEA-Leti, CEA-List, and CNRS built a complete memristor-based Bayesian neural network implementation for classifying types of arrhythmia recordings with precise aleatoric and epistemic uncertainty. While Bayesian neural networks are useful for at sensory processing applications based on a small amount of noisy input data because they ... » read more

Chip Industry Technical Paper Roundup: Jan. 23

By Liz Allan - 23 Jan, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=189 /] More ReadingTechnical Paper Library home » read more

3D Integration Supports CIM Versatility And Accuracy

By Katherine Derbyshire - 18 Jan, 2024 - Comments: 0

Compute-in-memory (CIM) is gaining attention due to its efficiency in limiting the movement of massive volumes of data, but it's not perfect. CIM modules can help reduce the cost of computation for AI workloads, and they can learn from the highly efficient approaches taken by biological brains. When it comes to versatility, scalability, and accuracy, however, significant tradeoffs are requir... » read more

Novel Neuromorphic Artificial Neural Network Circuit Architecture

By Technical Paper Link - 15 Jan, 2024 - Comments: 0

A technical paper titled “Mosaic: in-memory computing and routing for small-world spike-based neuromorphic systems” was published by researchers at CEA-LETI Université Grenoble Alpes, University of Zurich and ETH Zurich. Abstract: "The brain’s connectivity is locally dense and globally sparse, forming a small-world graph—a principle prevalent in the evolution of various species, sugg... » read more

Money Pours Into New Fabs And Facilities

By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

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Chip Industry Week In Review

Chip Industry Week In Review

Building CFETs With Monolithic And Sequential 3D

Chip Industry Technical Paper Roundup: Feb. 13

Benchmarking Electron Holography And Pixelated STEM On Various Semiconductor Structures

Research Bits: Jan. 23

Chip Industry Technical Paper Roundup: Jan. 23

3D Integration Supports CIM Versatility And Accuracy

Novel Neuromorphic Artificial Neural Network Circuit Architecture

Money Pours Into New Fabs And Facilities

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