Sustainable Hardware Specialization Through Reconfigurable Logic (NUS, Ghent Univ.)

By Technical Paper Link - 15 Nov, 2024 - Comments: 0

A new technical paper titled "Sustainable Hardware Specialization" was published by researchers at National University of Singapore and Ghent University. "We explore sustainable hardware specialization through reconfigurable logic that has the potential to drastically reduce the environmental footprint compared to a sea of accelerators by amortizing its embodied footprint across multiple a... » read more

Specialization Vs. Generalization In Processors

By Brian Bailey - 10 Aug, 2023 - Comments: 1

Academia has been looking at specialization for many years, but solutions were rejected because general-purpose solutions were advancing fast enough to keep up with most application requirements. That is no longer the case. The introduction and support of the RISC-V processor architecture has attracted a lot of attention, but whether that is the right direction for the majority of modern comput... » read more

A Full-Stack Domain-Specific Overlay Generation Framework Verified On FPGA

By Technical Paper Link - 12 Oct, 2022 - Comments: 0

A new technical paper titled "OverGen: Improving FPGA Usability through Domain-specific Overlay Generation" by researchers at UCLA and Chinese Academy of Sciences. "Our essential idea is to develop a hardware generation framework targeting a highly-customizable overlay, so that the abstraction gap can be lowered by tuning the design instance to applications of interest. We leverage and ext... » read more

SARA: Scaling a Reconfigurable Dataflow Accelerator

By Technical Paper Link - 02 Jul, 2021 - Comments: 0

Yaqi Zhang, Nathan Zhang, Tian Zhao, Matt Vilim, Muhammad Shahbaz, Kunle Olukotun (Stanford) Abstract—"The need for speed in modern data-intensive workloads and the rise of “dark silicon” in the semiconductor industry are pushing for larger, faster, and more energy and areaefficient architectures, such as Reconfigurable Dataflow Accelerators (RDAs). Nevertheless, challenges remain in d... » read more

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

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Megafabs churning out the most advanced processors are not the only game in town.

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tag: CGRA

Sustainable Hardware Specialization Through Reconfigurable Logic (NUS, Ghent Univ.)

Specialization Vs. Generalization In Processors

A Full-Stack Domain-Specific Overlay Generation Framework Verified On FPGA

SARA: Scaling a Reconfigurable Dataflow Accelerator

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Shift Left Is The Tip Of The Iceberg

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

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Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

Key Technologies To Extend EUV To 14 Angstroms

Memory Fundamentals For Engineers

What Comes After HBM For Chiplets

Why Small Fab And Assembly Houses Are Thriving

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tag: CGRA

Sustainable Hardware Specialization Through Reconfigurable Logic (NUS, Ghent Univ.)

Specialization Vs. Generalization In Processors

A Full-Stack Domain-Specific Overlay Generation Framework Verified On FPGA

SARA: Scaling a Reconfigurable Dataflow Accelerator

Trending Articles

Shift Left Is The Tip Of The Iceberg

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

Knowledge Centers Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

Key Technologies To Extend EUV To 14 Angstroms

Memory Fundamentals For Engineers

What Comes After HBM For Chiplets

Why Small Fab And Assembly Houses Are Thriving

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Knowledge Centers
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