Baum: Finding SoC Power Flaws

A South Korean startup founded by a Samsung engineer-turned-researcher has created a tool that finds power design flaws early in the SoC design process. The startup, Baum, Inc., launched the second version of its power-modeling solution in June at DAC. The product is a power design-verification tool that uses high-level models to create analyses designed to spot design flaws that could creat... » read more

New Stacking Issues

Reduced form factors, higher performance, and the demand for lower power necessitate the need for 3D-IC/silicon interposer designs with through-silicon vias (TSVs). That also creates major design challenges in three areas. The verification of power, signal, and reliability integrity—particularly with multi-stacked die on silicon interposer with TSVs—presents issues that can only be overcome... » read more