tag: chiplets

Managing kW Power Budgets
By Ed Sperling - 17 Jul, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss increasing power demands and how to address it with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product management at Siemens EDA; Mo Faisal, CEO of Movellus; Trey Roessig, CTO and senior vice president of engineering at Empower Semiconductor.... » read more

Intel Vs. Samsung Vs. TSMC
By Ed Sperling - 15 Jul, 2024 - Comments: 3

The three leading-edge foundries — Intel, Samsung, and TSMC — have started filling in some key pieces in their roadmaps, adding aggressive delivery dates for future generations of chip technology and setting the stage for significant improvements in performance with faster delivery time for custom designs. Unlike in the past, when a single industry roadmap dictated how to get to the next... » read more

Changes In Formal Verification
By Ed Sperling - 11 Jul, 2024 - Comments: 0

For the better part of two decades, formal verification was considered too difficult to use in many designs and too slow for anything but narrow bug hunting. Much has changed recently. Ashish Darbari, CEO of Axiomise, explains why formal is now essential for finding deadlocks, security holes, and Xprop issues in mission-critical, safety-critical, and AI designs, and how that will apply to chipl... » read more

X-ray Inspection Becoming Essential In Advanced Packaging
By Gregory Haley - 09 Jul, 2024 - Comments: 0

X-ray technology is moving into the mainstream of chip manufacturing as complex assemblies and advanced packaging make it increasingly difficult to ensure these devices will work as expected throughout their lifecycles. A single defect in a chiplet or interconnect can transform a complex advanced package into expensive scrap, and the risk only increases as the chip industry shifts from homog... » read more

Navigating Chiplet-Based Automotive Electronics Design With Advanced Tools And Flows
By Reela Samuel - 02 Jul, 2024 - Comments: 0

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive secto... » read more

Moving Software-Defined Vehicles Forward
By Ann Mutschler - 26 Jun, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

What’s Missing In Test
By Anne Meixner - 19 Jun, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how functional test content is brought up at first silicon, and the balance between ATE and system-level testing, with Klaus-Dieter Hilliges, V93000 platform extension manager at Advantest Europe; Robert Cavagnaro, fellow in the Design Engineering Group at Intel (responsible for manufacturing and test strategy of data center... » read more

When To Expect Domain-Specific AI Chips
By Brian Bailey - 13 Jun, 2024 - Comments: 0

The chip industry is moving toward domain-specific computation, while artificial intelligence (AI) is moving in the opposite direction, creating a gap that could force significant changes in how chips and systems are architected in the future. Behind this split is the amount of time it takes to design hardware and software. In the 18 months since ChatGPT was launched on the world, there has ... » read more

Probing Attacks Against Chiplets
By Technical Paper Link - 11 Jun, 2024 - Comments: 0

A technical paper titled “Evaluating Vulnerability of Chiplet-Based Systems to Contactless Probing Techniques” was published by researchers at University of Massachusetts and Worcester Polytechnic Institute. Abstract: "Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-... » read more

Power-Aware Revolution In Automated Test For ICs
By Gregory Haley - 11 Jun, 2024 - Comments: 0

As semiconductor devices advance in complexity and sensitivity to power fluctuations, the integration of power-aware automatic test pattern generation (ATPG) is becoming indispensable for yield and the overall functionality of a chip. Unlike traditional ATPG, which generates test patterns solely to ensure device functionality, power-aware ATPG takes it a step further by meticulously consider... » read more

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