Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 21 Apr, 2023 - Comments: 0

GlobalFoundries filed suit in U.S. District Court in New York against IBM, accusing it of unlawfully disclosing IP and trade secrets to IBM partners, including Intel and Rapidus, potentially receiving hundreds of millions of dollars in licensing income and other benefits. The European Union released a €43 billion ($47 billion) plan for jumpstarting its semiconductor manufacturing industry,... » read more

Technical Paper Round-Up: June 8

By Linda Christensen - 08 Jun, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=32 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a ... » read more

CORDIC-based Chip Design With Iterative Pipelining Architecture for Biped Robots

By Technical Paper Link - 03 Jun, 2022 - Comments: 0

New technical paper titled "Efficient and Accurate CORDIC Pipelined Architecture Chip Design Based on Binomial Approximation for Biped Robot," from researchers at Chung Yuan Christian University (Taiwan) and Ateneo de Manila University (Philippines). Abstract: "Recently, much research has focused on the design of biped robots with stable and smooth walking ability, identical to human bein... » read more

Technical Paper Round-up: May 17

By Linda Christensen - 17 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=27 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a go... » read more

SOT-MRAM-based CIM architecture for a CNN model

By Technical Paper Link - 09 May, 2022 - Comments: 0

New research paper "In-Memory Computing Architecture for a Convolutional Neural Network Based on Spin Orbit Torque MRAM", from National Taiwan University, Feng Chia University, Chung Yuan Christian University. Abstract "Recently, numerous studies have investigated computing in-memory (CIM) architectures for neural networks to overcome memory bottlenecks. Because of its low delay, high energ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Chung Yuan Christian University

Week In Review: Semiconductor Manufacturing, Test

Technical Paper Round-Up: June 8

CORDIC-based Chip Design With Iterative Pipelining Architecture for Biped Robots

Technical Paper Round-up: May 17

SOT-MRAM-based CIM architecture for a CNN model