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What’s Changing In DRAM


Most of the attention in chip scaling has been focused on logic and on-chip memory, but off-chip memory is starting to encounter problems, as well. David Fried, vice president of computational products at Lam Research, looks at the impact of shrinking features and increasing density, including variation, thermal effects and aging, as well as effects such as micro-loading and DRAM stacking. » read more

Adding Circuit Aging To Variability


Moving to a smaller node usually means another factor becomes important. The industry has become accustomed to doing process, temperature, voltage (PVT) corner analysis, but now it has to add aging into that mix. The problem is that planning for circuit aging is no longer a purely statistical process. Aging is dependent on activity over the lifetime of the device. Tools need to be modified a... » read more

Customizing Chips For Power And Performance


Sandro Cerato, senior vice president and CTO of the Power & Sensor Systems Business Unit at Infineon Technologies, sat down with Semiconductor Engineering to talk about fundamental shifts in chip design with the rollout of the edge, AI, and more customized solutions. What follows are excerpts of that conversation. SE: The chip market is starting to fall into three distinct buckets, the e... » read more

Configuring AI Chips


Change is almost constant in AI systems. Vinay Mehta, technical product marketing manager at Flex Logix, talks about the need for flexible architectures to deal with continual modifications in algorithms, more complex convolutions, and unforeseen system interactions, as well as the ability to apply all of this over longer chip lifetimes. Related Dynamically Reconfiguring Logic A differ... » read more

Monitoring Chips On Many Levels


Monitoring is an important trend for optimizing yield, performance, and uptime in systems that use complex integrated circuits, but not all monitoring is the same. In fact, there are multiple levels of monitors. In many cases, they can be used together to help solve problems when something is amiss. They also can be used to help identify who in the supply chain owns the fix. “If the sys... » read more

Design For Reliability


Circuit aging is emerging as a mandatory design concern across a swath of end markets, particularly in markets where advanced-node chips are expected to last for more than a few years. Some chipmakers view this as a competitive opportunity, but others are unsure we fully understand how those devices will age. Aging is the latest in a long list of issues being pushed further left in the desig... » read more

Automotive Test Moves In-System


With the electrification of automobiles, it’s not enough to test the new electronics thoroughly at the end of the manufacturing process. Safety standards now require that tests be performed live, in the field, with contingency plans should a test fail. “We see clear demand from the automotive semiconductor supply chain for design functionality specifically aimed at in-system monitoring,... » read more

Sensor Fusion Challenges In Cars


The automotive industry is zeroing in on sensor fusion as the best option for dealing with the complexity and reliability needed for increasingly autonomous vehicles, setting the stage for yet another shift in how data from multiple devices is managed and utilized inside a vehicle. The move toward greater autonomy has proved significantly more complicated than anyone expected at first. There... » read more

Security At The Edge


Semiconductor Engineering sat down to discuss security at the edge with Steven Woo, vice president of enterprise solutions technology and distinguished inventor at Rambus, Kris Ardis, executive director at Maxim Integrated; and Steve Roddy, vice president of Arm's Products Learning Group. What follows are excerpts of that conversation. To view part one of this discussion, click here. Part two i... » read more

Custom Designs, Custom Problems


Semiconductor Engineering sat down to discuss power optimization with Oliver King, CTO at Moortec; João Geada, chief technologist at Ansys; Dino Toffolon, senior vice president of engineering at Synopsys; Bryan Bowyer, director of engineering at Mentor, a Siemens Business; Kiran Burli, senior director of marketing for Arm's Physical Design Group; Kam Kittrell, senior product management group d... » read more

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