tag: Cisco

The Week In Review: Aug. 19
By Mark LaPedus - 19 Aug, 2013 - Comments: 0

By Mark LaPedus Applied Materials named Gary Dickerson, who has been serving as president of the company, as CEO. Mike Splinter, who held the reins since 2003, was elevated to executive chairman of the board. Dickerson served as the CEO of Varian, which Applied acquired in 2011, as well as the president and COO of KLA-Tencor. Applied Materials also announced its Q3 results. The company rep... » read more

IoT Brings Power Awareness Opportunities
By Ann Mutschler - 08 Aug, 2013 - Comments: 0

By Ann Steffora Mutschler Limited only by imagination, the “Internet of Things” (IoT) is breathing new life into many segments of the semiconductor industry that are losing hopes for growth in the SoC market. In virtually any vertical market space, from automotive to consumer, from industrial to networking, one can imagine the potential for what IoT concepts could realize including higher ... » read more

System-Level Security Issues
By Ed Sperling - 25 Jul, 2013 - Comments: 0

The more things that are put onto a single SoC, the greater the possibility that the entire system can be hacked. Centralization is good from the standpoint of speed, cost and power, but it’s not always good from the standpoint of security. This may sound contrary to the experience of corporate IT departments, but there’s a reason behind this. In the case of data centers, the advent of t... » read more

Experts At The Table: The Internet Of Everything
By Ed Sperling - 30 May, 2013 - Comments: 0

By Ed Sperling System-Level Design sat down to discuss the Internet of Things with Jack Guedj, president and CEO of Tensilica; John Heinlein, vice president of marketing for the physical IP division of ARM; Kamran Izadi, director of sourcing and supplier management at Cisco; and Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division. Wh... » read more

Experts At The Table: The Internet Of Everything
By Ed Sperling - 03 May, 2013 - Comments: 0

By Ed Sperling System-Level Design sat down to discuss the Internet of Things with Jack Guedj, president and CEO of Tensilica; John Heinlein, vice president of marketing for the physical IP division of ARM; Kamran Izadi, director of sourcing and supplier management at Cisco; and Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division. Wh... » read more

Experts At The Table: The Internet Of Everything
By Ed Sperling - 25 Apr, 2013 - Comments: 0

By Ed Sperling System-Level Design sat down to discuss the Internet of Things with Jack Guedj, president and CEO of Tensilica; John Heinlein, vice president of marketing for the physical IP division of ARM; Kamran Izadi, director of sourcing and supplier management at Cisco; and Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division. Wh... » read more

The Smartphonification Of Things
By Ann Mutschler - 28 Mar, 2013 - Comments: 0

By Ann Steffora Mutschler The term, ‘Internet of Things,’ was first coined more than a decade ago by technology visionary Kevin Ashton but has slowly trickled down to the world of chip design and is now mentioned constantly in conversation. The reason is simple: System-level design tools are getting sophisticated enough to handle the intricacies required by devices in an Internet of ... » read more

The Business Of Things
By Frank Ferro - 28 Mar, 2013 - Comments: 0

By Frank Ferro The Internet of things (IOT) will create $14 trillion dollars in business opportunities according to Cisco. Unless you are a government accumulating debt, most of us think that’s a big number—and a big opportunity. The much quoted “50 billion connected devices to the Internet by 2020” forecast is the impetus driving companies in all parts of the ecosystem including infra... » read more

Market Realities
By Ed Sperling - 28 Mar, 2013 - Comments: 0

The speculation about EDA’s future—will it consolidate, will it be incorporated into large IDMs or foundries—has surfaced again. The reason this time is that EDA is in a retrenchment period as the semiconductor industry grapples with increasing complexity, multiple options ranging from multi-patterning to stacked die to more third-party IP, and the rising cost of complex SoCs at the mo... » read more

Stacked Die From A Networking Angle
By Mark LaPedus - 24 Jan, 2013 - Comments: 1

By Mark LaPedus The first wave of 2.5D chips using silicon interposers are trickling out in the marketplace.FPGA vendor Xilinx was the first chipmaker to ship a 2.5D device, and Altera, Cisco, Huawei and IBM recently have talked about their respective 2.5D chip developments. Generally, Altera and Xilinx have taken a somewhat identical and straightforward approach. The two companies are sepa... » read more

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