Automotive MEMS Accelerometer Design Verification: A Real Life Example

Standard Finite Element (FE) models, especially those that incorporate multiple physical domains, consist of detailed representations of a device that include a large number of Degrees of Freedom (DoF). The Degrees of Freedom in a design are the number of independent variables or parameters needed to describe the motion or state of the device. Generally, the larger the number of Degrees of Free... » read more

Artificial Neural Network (ANN)-Based Model To Evaluate The Characteristics of A Nanosheet FET (NSFET)

This new technical paper titled "Machine-Learning-Based Compact Modeling for Sub-3-nm-Node Emerging Transistors" was published by researchers at SungKyunKwan University, Korea. Abstract: "In this paper, we present an artificial neural network (ANN)-based compact model to evaluate the characteristics of a nanosheet field-effect transistor (NSFET), which has been highlighted as a next-generat... » read more

A Compact Model For Scalable MTJ Simulation

Read the full technical paper. Published June 9, 2021. Abstract This paper presents a physics-based modeling framework for the analysis and transient simulation of circuits containing Spin-Transfer Torque (STT) Magnetic Tunnel Junction (MTJ) devices. The framework provides the tools to analyze the stochastic behavior of MTJs and to generate Verilog-A compact models for their simulation in lar... » read more

Shock Value

By Norman Chang Chip-Package-System (CPS) ESD simulation enables system-wide ESD robustness validation, a common challenge in automotive and aerospace applications. To enable CPS ESD analysis requires an accurate chip electrostatic discharge (ESD) model and a comprehensive system-level ESD methodology. Using an accurate ESD chip model provides the following three benefits. First it helps de... » read more