Power Delivery Challenges For AI Chips
Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.
TSMC: King Of Data Center AI
Opinion: The foundry makes all of the logic chips critical for AI data centers, and might do so for years to come.
Novel Assembly Approaches For 3D Device Stacks
ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged optics.
Chip Industry Week in Review
$60B fab buildout; Chinese automakers tout 100% homemade chips; 2nm custom SRAM; Cadence's virtual platform buy; multi-chiplet NoC; HBM roadmap; MIT's GaN fab technique; 30% tax credit; Taiwan export restrictions, power vulnerability; global memory market; rad-tolerant memory; 2D, non-silicon computer.
EDA’s Top Execs Map Out An AI-Driven Future
AI is accelerating the need for 3D-ICs and digital twins, and causing lots of disruption along the way.
Startup Funding: Q1 2025
AI chips and data center communications see big funding; 75 startups raise $2 billion.
Advanced Packaging Fundamentals for Semiconductor Engineers
New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
Chip Industry Week in Review
AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.
Chip Industry Week in Review
EDA export controls; Synopsys-Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; China's legacy chips play; AMD's optical acquisition.
RISC-V’s Increasing Influence
Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need a bridge to get to where it needs to be.
Chip Industry Week in Review
IC, AI global ranking; China's fully automated IC design system; Micron goes bigger; PCIe 7.0 spec; TSMC-Tokyo joint lab; panel-level packaging win; first neuromorphic compute system; GAA forksheets; AMD's new GPUs.
Big Changes Ahead For Interposers And Substrates
New materials and processes will help with power distribution and thermal dissipation in advanced packages.
What Exactly Are Chiplets And Heterogeneous Integration?
New technologies drive new terminology, but the early days for those new approaches can be very confusing.
