RTL Restructuring Issues

By Ed Sperling - 18 Jul, 2023 - Comments: 0

Modification of modules in RTL is the last place in chip design where changes can be made relatively easily before they reach physical design, but it’s still as complicated as the design itself — and it becomes more difficult in 3D-ICs. Jim Schultz, product marketing manager for digital design implementation at Synopsys, talks about grouping and ungrouping, re-parenting, and breaking connec... » read more

ML-based Routing Congestion And Delay Estimation In Vivado ML Edition

By Xilinx - 03 Nov, 2021 - Comments: 0

The FPGA physical design flow offers a compelling opportunity for Machine Learning for CAD (MLCAD) for the following reasons: • An ML solution can be applied wholesale to a device family. • There is a vast data farm that can be harvested from device models and design data from broad applications. • There is a single streamlined design flow that an be instrumented, annotated, and quer... » read more

How To Reduce Timing Closure Headaches

By Kurt Shuler - 22 Dec, 2015 - Comments: 0

As chips have become more complex, timing closure has provided some of the most vexing challenges facing design engineers today. This step requires an increasing amount of time to complete and adds significantly to design costs and back-end schedule risks. Wire delay dominates transistor switching delay Building high-performance modern CPUs involves pipelining to achieve high frequencies. I... » read more

Routing Congestion Returns

By Ed Sperling - 26 Jul, 2012 - Comments: 0

By Ed Sperling Routing congestion has returned with a vengeance to SoC design, fueled by the advent of more third-party IP, more memory, a variety of new features, as well as the inability to scale wires at the same rate as transistors. This is certainly not a foreign concept for IC design. The markets for place and route tools were driven largely by the need to automate this kind of operat... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

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Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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by Laura Peters

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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tag: congestion

RTL Restructuring Issues

ML-based Routing Congestion And Delay Estimation In Vivado ML Edition

How To Reduce Timing Closure Headaches

Routing Congestion Returns