CEO Outlook On Chip Industry


Semiconductor Engineering sat down with Wally Rhines, president and CEO of Mentor, a Siemens Business; Simon Segars, CEO of Arm; Grant Pierce, CEO of Sonics; and Dean Drako, CEO of IC Manage. What follows are excerpts of that conversation. L-R: Dean Drako, Grant Pierce, Wally Rhines, Simon Segars. Photo: Paul Cohen/ESD Alliance SE: What are the big changes ahead, and where do you see th... » read more

OSAT Consolidation Continues


Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd. (SPIL) are beginning the process of uniting the two companies, which are among the largest outsourced semiconductor assembly and testing contractors in the world. For now, the companies will continue to operate separately, while their shares are traded under the ASX symbol on the New York Stock Exchange. ASE I... » read more

Executive Insight: Wally Rhines


Wally Rhines, president and CEO of [getentity id="22017" e_name="Mentor, a Siemens Business"], sat down with Semiconductor Engineering to discuss a wide range of industry and technology changes and how that will play out over the next few years. What follows are excerpts of that conversation. SE: What will happen in the end markets? Rhines: The end markets are perhaps more exciting from a... » read more

Monetizing Semiconductors From Silicon To Services


In 2016, Rambus published a think piece titled “Charting a New Course for Semiconductors.” The paper explored a diverse range of challenges faced by the industry, including increasing development costs, shrinking margins, market saturation and accelerating M&A activity. These challenges have only become more pronounced in 2018, as the newly consolidated semiconductor industry actively seeks... » read more

Packaging Challenges For 2018


The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

Automotive Foundries


The race to win a piece of the automotive electronics business has now reached the foundry level, and right now it's not clear exactly how this is going to work. This is uncharted territory for everyone. The build-out of electronics for assisted and autonomous driving is brand new. For existing cars, most of the chips being used are off-the-shelf microcontrollers, commodity MEMS sensors, and... » read more

Executive Insight: Wally Rhines


Wally Rhines, president and CEO of [getentity id="22017" e_name="Mentor, a Siemens Business"], sat down with Semiconductor Engineering to talk about industry consolidation, a shift in emphasis from chips to systems, and what the recent acquisition by Siemens will mean for Mentor. What follows are excerpts of that conversation. SE: A year ago it looked as if the entire industry was going to b... » read more

What Next For OSATs


Semiconductor Engineering sat down to discuss IC-packaging and business trends with Tien Wu, chief operating officer at Taiwan’s Advanced Semiconductor Engineering ([getentity id="22930" comment="ASE"]), the world’s largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What’s the outlook for the IC industry in 2017? Wu:... » read more

OSAT Biz: Growth And Challenges


Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

Rethinking Stats In Manufacturing Equipment


Consolidation, slower market growth due to increasing complexity, and extended lead times have prompted SEMI to drop its book-to-bill reports. Long considered the best way to assess the health of the semiconductor manufacturing equipment business, the industry organization now views the book-to-bill report as far less valuable than in the past. "At the leading edge, there are only a handf... » read more

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