Data Center Thermal Management Improves


Thermal issues are plaguing semiconductor design at every level, from chips developed with single-digit nanometer processes to 100,000-square-foot data centers. The underlying cause is too many devices or services that require increasing amounts of power, and too few opportunities for the resulting heat to dissipate. “Everybody wants to try to do more in a small volume of space,” said St... » read more

IC Industry’s Growing Role In Sustainability


The massive power needs of AI systems are putting a spotlight on sustainability in the semiconductor ecosystem. The chip industry needs to be able to produce more efficient and lower-power semiconductors. But demands for increased processing speed are rising with the widespread use of large language models and the overall increase in the amount of data that needs to be processed. Gartner estima... » read more

Liquid Cooling And GaN: A Winning Combination


Data centers are facing an unprecedented transformation due to the surge in generative AI and other emerging technologies. A single ChatGPT session consumes 50 to 100 times more energy than a comparable Google search, escalating data center rack power requirements towards 200 kW or more, presenting serious challenges for operators. Cooling, in fact, takes up about 40% of the power requireme... » read more

Package Integrated Vapor Chamber Heat Spreaders


With continuous increases in computational demand in nearly all electronics market segments, even historically lower power packaging is being driven into challenging thermal management situations. Node shrink alone is reaching a limit in maintaining track with Moore’s law. The economics and yield challenges of large monolithic system on chip (SoC) designs are driving the development of silico... » read more

Cooling The Data Center


Since British mathematician and entrepreneur Clive Humby coined the rallying cry, “Data is the new oil,” some 20 years ago, it has been an upbeat phrase at data science conferences. But in engineering circles, that increasingly includes a daily grind of hardware challenges, and chief among them is how to cool the places where all that data is processed and stored. An estimated 65 zettaby... » read more

Thermal Management Challenges and Requirements of 3 types of Microelectronic Devices


New technical paper titled "A Review on Transient Thermal Management of Electronic Devices" from researchers at Indian Institute of Technology Bombay. Abstract "Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varyi... » read more

Advancing Electric Vehicle Battery Characterization By Integrating Drive Cycle On Cooling Impacts


Battery powered electric vehicles (EVs) and hybrid electric vehicles (HEVs) have been gaining market share as the public’s environmental concerns drive the demand for better fuel efficiency. Apart from the need to improve the mileage one can drive before recharging, battery reliability is another major concern. Effective cooling in intense charge/discharge conditions is crucial to minimizi... » read more

Thermal Management Implications For Heterogeneous Integrated Packaging


As the semiconductor industry reaches lower process nodes, silicon designers struggle to have Moore's Law produce the results achieved in earlier generations. Increasing the die size in a monolithic system on chip (SoC) designs is no longer economically viable. The breakdown of monolithic SoCs into specialized chips, referred to as chiplets, presents significant benefits in terms of cost, yield... » read more

Power/Performance Bits: Feb. 8


Transparent sensor Researchers at Osaka University created a thin, flexible, transparent sensor using silver nanowire networks. High-resolution printing was used to fabricate the centimeter-scale cross-aligned silver nanowire arrays, with reproducible feature sizes from 20 to 250 micrometers. As a proof-of-concept for functionality, they used their arrays to detect electrophysiological signals... » read more

Power/Performance Bits: Nov. 9


Integrated transistor cooling Researchers at Ecole Polytechnique Fédérale de Lausanne (EPFL) created a single chip that combines a transistor and microfluidic cooling system for more efficient transistor heat management. The team focused on a co-design approach for the electrical and mechanical aspects of the chip, bringing the electronics and cooling design together and aiming to extract... » read more

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