The Race To Glass Substrates

By Gregory Haley - 29 May, 2024 - Comments: 4

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve. Glass has been discussed as a replacement material for silicon and organic substrates for more than a decade, primarily in multi-die packages. But ... » read more

The Glass Substrate Question: When Will It Replace Copper Clad Laminate?

By Keith Best - 12 Sep, 2023 - Comments: 0

"When will glass replace copper clad laminate on advanced IC substrates?" That’s a question many on the heterogeneous integration (HI) side of the semiconductor industry are asking. Unfortunately, the answer is not straightforward. But before we get to answering that, let’s take an advanced IC substrate (AICS) refresher. In other words, how did we get to the point where glass substrat... » read more

Analysis Of Pattern Distortion By Panel Deformation And Addressing It By Using Extremely Large Exposure Field Fine-Resolution Lithography

By Onto Innovation - 11 Oct, 2022 - Comments: 0

The growing demand for heterogeneous integration is driven by the 5G market. This includes smartphones, data centers, servers, high-performance computing (HPC), artificial intelligence (AI) and internet of things (IoT) applications. Next-generation packaging technologies require tighter overlay to accommodate larger package sizes with fine-pitch chip interconnects on large-format flexible panel... » read more

Wirebond IC Substrates: Challenges Ahead

By Prasad Dhond - 17 Mar, 2022 - Comments: 0

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about "limited tenting capacity," "no support for EBS designs," and requests for "conversion to etchback" designs. What does all this mean? Let's start with "Line" and "Space." "Line" is the width of a trace on a substrate and "Space" is the distance between the two traces. For wirebond packages such a... » read more

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tag: copper clad laminate

The Race To Glass Substrates

The Glass Substrate Question: When Will It Replace Copper Clad Laminate?

Analysis Of Pattern Distortion By Panel Deformation And Addressing It By Using Extremely Large Exposure Field Fine-Resolution Lithography

Wirebond IC Substrates: Challenges Ahead

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