tag: Cornell University

System Bits: March 1
By Ann Mutschler - 01 Mar, 2016 - Comments: 0

Current generation silicon wafer While the single-crystal silicon wafer changed the nature of communication 60 years ago, a group of Cornell researchers is now hoping its work with quantum dot solids can usher in a new era in electronics. In what could be the first step toward discovering and developing artificial materials with controllable electronic structure, the team has fashioned 2D s... » read more

Power/Performance Bits: Dec. 23
By Jesse Allen - 23 Dec, 2015 - Comments: 0

GaN building blocks A team of engineers from Cornell University, the University of Notre Dame, and the semiconductor company IQE created gallium nitride (GaN) power diodes capable of serving as the building blocks for future GaN power switches. In spite of having many desirable features as a material, GaN is notorious for its defects and reliability issues. So the team zeroed in on device... » read more

Can Nano-Patterning Save Moore’s Law?
By Mark LaPedus - 19 Nov, 2015 - Comments: 0

For years the academic community has explored a novel technology called selective deposition. Then, more than a year ago, Intel spearheaded an effort to bring the technology from the lab to the fab at 7nm or 5nm. Today, selective deposition is still in R&D, but it is gaining momentum in the industry. With R&D funding from Intel and others, selective deposition, sometimes called ALD-e... » read more

New Patterning Paradigm?
By Mark LaPedus - 16 Apr, 2015 - Comments: 0

Chip scaling is becoming more difficult at each process node, but the industry continues to find new and innovative ways to solve the problems at every turn. And so chipmakers continue to march down the various process nodes. But the question is for how much longer? In fact, at 16nm/14nm and beyond, chipmakers are finding new and different challenges, which, in turn, could slow IC scaling or br... » read more

Issues And Options At 5nm
By Mark LaPedus - 19 Mar, 2015 - Comments: 0

While the foundries are ramping up their processes for the 16nm/14nm node, vendors are also busy developing technologies for 10nm and beyond. In fact, chipmakers are finalizing their 10nm process offerings, but they are still weighing the technology options for 7nm. And if that isn’t enough, IC makers are beginning to look at the options at 5nm and beyond. Today, chipmakers can see a p... » read more

The Week In Review: Design/IoT
By Jesse Allen - 13 Feb, 2015 - Comments: 0

Mergers/Acquisitions ARM acquired Offspark, a Dutch company specializing in IoT communications security. Use of Offspark's PolarSSL embedded Transport Layer Security (TLS) solution is widespread in the IoT industry. PolarSSL will be rebranded mbed TLS and integrated into ARM's mbed OS. Tools Mentor Graphics is bringing together a suite of technologies that enable a multi-platform appro... » read more

System Bits: Feb. 10
By Ann Mutschler - 10 Feb, 2015 - Comments: 0

Mapping temperature Given that overheating is a major problem for chips today a team of UCLA and USC scientists have made a breakthrough that they believe should enable engineers to design microprocessors that minimize that problem with a thermal imaging technique that can see how the temperature changes from point to point inside the smallest electronic circuits. The technique is called pl... » read more

System Bits: Dec. 30
By Ann Mutschler - 30 Dec, 2014 - Comments: 0

3D printing merges plastics, active electronics Princeton researchers have embedded tiny light-emitting diodes into a standard contact lens, allowing the device to project beams of colored light as part of a project demonstrating 3-D printing techniques. And while the lens is not designed for actual use — it requires an external power supply — the device was created to demonstrate the a... » read more

System Bits: July 29
By Ed Sperling - 29 Jul, 2014 - Comments: 0

Cooper Pairs Researchers at the University of Illinois at Chicago, Cornell University and Brookhaven National Laboratory say they have unlocked what they’re calling quantum glue—the underlying basis for creating energy conduits without current loss. In superconductors, electrical resistance vanishes below a critical temperature and conduction electrons form ordered pairs, known as Coop... » read more

Manufacturing Bits: Dec. 10
By Mark LaPedus - 10 Dec, 2013 - Comments: 0

Space Telescopes The James Webb Space Telescope, the follow-on mission to the Hubble Space Telescope, is a large, infrared-optimized space telescope. Slated for a launch date of 2018, Webb will find the first galaxies that were formed in the early Universe. Webb is a collaboration between NASA, the European Space Agency (ESA) and the Canadian Space Agency (CSA). Webb’s measurements will ... » read more

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