Week In Review: Design, Low Power

By Jesse Allen - 09 Jun, 2023 - Comments: 0

Renesas Electronics completed its acquisition of Panthronics, a fabless company specializing in near-field communication (NFC) wireless products. Renesas has already incorporated Panthronics NFC technology into several solution reference designs for applications such as payment, IoT, asset tracking, and smart meters. The European Commission announced new funding for the semiconductor and mic... » read more

Week In Review: Design, Low Power

By Jesse Allen - 18 Jun, 2021 - Comments: 0

Rambus is making a push for Compute Express Link (CXL) with two acquisitions and the launch of its CXL Memory Interconnect Initiative. The initiative aims to define and develop semiconductor solutions for advanced data center architectures, with initial research and development focusing on solutions to support key memory expansion and pooling use cases. CXL is an open interconnect specificat... » read more

Week In Review: Design, Low Power

By Jesse Allen - 29 Mar, 2019 - Comments: 0

ON Semiconductor will acquire Quantenna Communications for $24.50 per share in an all cash transaction, representing an equity value of approximately $1.07 billion and enterprise value of approximately $936 million. Quantenna, a maker of Wi-Fi chipsets, was founded in 2006 and went public in late 2016. Tools & IP Achronix completed testing and is now demonstrating the 112 Gbps SerDes th... » read more

RISC-V Pros And Cons

By Ann Mutschler - 29 May, 2017 - Comments: 7

Simpler, faster, lower-power hardware with a free, open, simple instruction set architecture? While it sounds too good to be true, efforts are underway to do just that with RISC-V, the instruction-set architecture (ISA) developed by UC Berkeley engineers and now administered by a foundation. It has been known for some time that with [getkc id="74" comment="Moore's Law"] not offering the same... » read more

The Week In Review: Design

By Jesse Allen - 14 Oct, 2016 - Comments: 0

M&A Mentor Graphics acquired Galaxy Semiconductor, a provider of test data analysis and defect reduction software ranging from initial characterization of sample devices to automated yield management of large-scale production. The Galway, Ireland company was founded in 1998. Terms of the deal were not disclosed. IP Imagination rolled out a new heterogeneous MIPS CPU with many core/... » read more

Foundries Expand Planar Efforts

By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 12 Jun, 2015 - Comments: 0

Christopher Rolland, an analyst at FBR, made a startling statement in a recent report. “At the pace of consolidation set thus far this year, 32% of all U.S. publicly traded semiconductor companies would be acquired in 2015! While this run-rate is not likely sustainable and should slow as the year progresses, we still expect ~15% consolidation rates for the remainder of this cycle (above low-t... » read more

Atoms, ARMs, ARCs, Andes…And All The Rest

By Brian Bailey - 07 Nov, 2013 - Comments: 0

There was a time when nobody believed Intel processors would be replaced with any other device. Intel commanded the processor market. Rich Wawrzyniak, senior analyst for ASIC SoC at Semico Research, noted this was not always the case. In the early days of the PC there were many contenders and most people thought that Motorola would win because they had more money behind them. Ultimately, Intel ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Cortus

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

RISC-V Pros And Cons

The Week In Review: Design

Foundries Expand Planar Efforts

The Week In Review: Manufacturing

Atoms, ARMs, ARCs, Andes…And All The Rest