Week In Review: Manufacturing, Test

By Mark LaPedus - 23 Jul, 2021 - Comments: 0

Chipmakers and OEMs The industry is still wondering if Intel will buy GlobalFoundries (GF). In the meantime, GF has announced a fab expansion plan in upstate New York. These plans include immediate investments at its existing Fab 8 facility as well as construction of a new fab on the same campus. That will double the capacity at the site. Intel has reported its second-quarter 2021 financial... » read more

Cloudy Outlook Seen For IC Biz

By Mark LaPedus - 29 Jul, 2019 - Comments: 0

After a slowdown in the first half of 2019, chipmakers and equipment vendors face a cloudy outlook for the second half of this year, with a possible recovery in 2020. Generally, the semiconductor industry began to see a slowdown starting in mid- to late-2018, which extended into the first half of 2019. During the first half of this year, memory and non-memory vendors were negatively impacted... » read more

Challenges In Making And Testing STT-MRAM

By Mark LaPedus - 07 May, 2019 - Comments: 1

Several chipmakers are ramping up a next-generation memory type called STT-MRAM, but there are still an assortment of manufacturing and test challenges for current and future devices. STT-MRAM, or spin-transfer torque MRAM, is attractive and gaining steam because it combines the attributes of several conventional memory types in a single device. In the works for years, STT-MRAM features the ... » read more

The Uncertain Future Of Hard Drives

By Michael Watts - 17 Jul, 2014 - Comments: 0

The future of hard drives has been an iffy subject for nearly a decade. The most recent pressure has come from solid-state drives made from flash memory, which have transformed cell phones and tablets and other portable appliances. But the Internet has driven a staggering demand for data storage and the hard drive business has thrived. The question of what’s next for hard drives first appe... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Coughlin Associates

Week In Review: Manufacturing, Test

Cloudy Outlook Seen For IC Biz

Challenges In Making And Testing STT-MRAM

The Uncertain Future Of Hard Drives