tag: Coventor

Fast Analysis Of Acoustic Resonators For The Rapidly Growing Premium RF Filter Market
By Coventor - 18 May, 2016 - Comments: 0

Acoustic resonator filters have been used in cell phones since the early 2G wireless standard. Now, typical smart phones employ 30 or more filters as mobile carriers push to support more and more data bands as well as Wi-Fi, Bluetooth and GPS. Market pressure for these RF filters to be compact and inexpensive, yet meet the higher performance requirements of the 4G standards, has spurred great i... » read more

Next EUV Challenge: Pellicles
By Mark LaPedus - 27 Apr, 2016 - Comments: 1

Extreme ultraviolet (EUV) lithography is still not ready for high-volume manufacturing, but the technology is at least moving in the right direction. Both the [gettech id="31045" comment="EUV"] light source and resists are making noticeable progress, even though there are still challenges in the arena. And then, there is the EUV mask infrastructure, which also has some gaps. “When EUV i... » read more

7nm Fab Challenges
By Mark LaPedus - 21 Apr, 2016 - Comments: 3

Leading-edge foundry vendors have made the challenging transition from traditional planar processes into the finFET transistor era. The first [getkc id="185" kc_name="finFETs"] were based on the 22nm node, and now the industry is ramping up 16nm/14nm technologies. Going forward, the question is how far the finFET can be scaled. In fact, 10nm finFETs from Samsung are expected to ramp by ye... » read more

Modeling Semiconductor Process Variation
By Coventor - 21 Apr, 2016 - Comments: 0

3D semiconductors, 3D NAND Flash, FinFETS and other advanced devices are bringing tremendous opportunities to the semiconductor industry. Unfortunately, these devices are also bringing new design, process and production problems. Process variability has been a major contributor to production delays as feature sizes have decreased and process complexity has increased. Virtual fabrication is a co... » read more

The Future Of MEMS Sensor Design And Manufacturing
By Stephen Breit - 21 Apr, 2016 - Comments: 0

I recently gave an invited talk at the IEEE Inertial Sensors 2016 symposium that discussed the future of commodity MEMS inertial sensor design and manufacturing. Inertial sensors comprise one of the fastest growing and most successful segments of the MEMS market. There are three industry trends that I believe will have major implications for motion sensor design and manufacturing and, more g... » read more

Inside Process Technology
By Mark LaPedus - 21 Apr, 2016 - Comments: 1

Semiconductor Engineering sat down to discuss the foundry business, memory, process technology, lithography and other topics with David Fried, chief technology officer at [getentity id="22210" e_name="Coventor"], a supplier of predictive modeling tools. What follows are excerpts of that conversation. SE: Chipmakers are ramping up 16nm/14nm finFETs today, with 10nm and 7nm finFETs just around... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 18 Mar, 2016 - Comments: 0

Intel announced that the company’s former CEO and chairman, Andrew Grove, passed away. He was 79. Present at Intel’s 1968 founding with Robert Noyce and Gordon Moore, Grove became Intel’s president in 1979 and CEO in 1987. He served as chairman from 1997 to 2005. “We are deeply saddened by the passing of former Intel Chairman and CEO Andy Grove,” said Intel CEO Brian Krzanich, in a st... » read more

Multi-Beam Market Heats Up
By Mark LaPedus - 17 Mar, 2016 - Comments: 3

The multi-beam e-beam mask writer business is heating up, as Intel and NuFlare have separately entered the emerging market. In one surprising move, [getentity id="22846" e_name="Intel"] is in the process of acquiring IMS Nanofabrication, a [gettech id="31058" t_name="multi-beam e-beam"] equipment vendor. And separately, e-beam giant NuFlare recently disclosed its new multi-beam mask writer t... » read more

Will Directed Self-Assembly Pattern 14nm DRAM?
By Mattan Kamon - 17 Mar, 2016 - Comments: 1

Will directed self-assembly (DSA) join Extreme Ultraviolet (EUV) Lithography and next-generation multi-patterning techniques to pattern the next memory and logic technologies? Appealing to the wisdom of crowds, the organizers of the 2015 1st International DSA symposium recently surveyed the attendees. Nearly 75% believed DSA would insert into high-volume manufacturing within the next 5 years... » read more

3D NAND Flash Processing
By Coventor - 16 Mar, 2016 - Comments: 0

Coventor’s powerful SEMulator3D semiconductor process modeling platform offers a wide range of technology development capabilities for the development of cutting edge 3D NAND Flash Technology. 3D NAND promises high memory cell density with reduced data corruption, but also brings processing challenges. The structural complexity and inherent 3D nature of devices using 3D NAND require a predict... » read more

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