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Co-Packaged Optics And The Evolution Of Switch/Optical Interconnects In Data Centers


Driven by a need to reduce power and increase bandwidth density in data center network switches and other devices, the data networking industry is moving toward adoption of co-packaged optics (CPO). This paper provides a brief overview of the history of copper and optical interconnects, the limitations of existing interconnect solutions, and the future of co-packaged optics, including the benef... » read more

Enabling Chiplet And Co-Packaged Optics Architectures With 112G XSR SerDes


Conventional chip designs are struggling to achieve the scalability, as well as power, performance, and area (PPA), that are demanded of leading-edge designs. With the slowing of Moore’s Law, high complexity ASICs increasingly bump up against reticle limits. The demise of Dennard scaling means power consumption is a growing challenge. In this context, disaggregated architectures such as chipl... » read more