Rethinking Processor Architectures

By Ed Sperling - 05 May, 2016 - Comments: 2

The semiconductor industry's obsession with clock speeds, cores and how many transistors fit on a piece of silicon may be nearing an end for real this time. The [getentity id="22048" comment="IEEE"] said it will develop the International Roadmap for Devices and Systems (IRDS), effectively setting the industry agenda for future silicon benchmarking and adding metrics that are relevant to specifi... » read more

New Metrics For The Cloud

By Ed Sperling - 10 Sep, 2015 - Comments: 0

Data centers are beginning to adjust their definition of what makes one server better than another. Rather than comparing benchmarked performance of general-purpose servers, they are adding a new level of granularity based upon what kind of chips work best for certain operations or applications. Those decisions increasingly include everything from the level of redundancy in compute operations, ... » read more

What’s Really Inside?

By Ed Sperling - 04 Jun, 2015 - Comments: 2

Is it just paranoia, or do devices ranging from industrial controls to military hardware really contain malicious code, Trojan Horses, and remotely triggered back doors? The answer is "maybe not" if you're an optimist, and "maybe" if you're a pessimist, but no one really knows for sure. And that's what really worries security experts, particularly as more devices are connected to other devices.... » read more

The Ubiquitous GPU

By Ann Mutschler - 27 Jun, 2013 - Comments: 0

By Ann Steffora Mutschler No matter the application area, GPUs are likely playing a role like never before—even to accelerate EDA software algorithms. It’s no wonder given the ability of GPUs to handle parallel processing much more effectively than CPUs. And when coexisting in a heterogeneous system, GPUs allow the design team to maximize efficiency and performance by allocating tasks... » read more

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Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: CPUs

Rethinking Processor Architectures

New Metrics For The Cloud

What’s Really Inside?

The Ubiquitous GPU

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