tag: Cree

The Week In Review: Manufacturing
By Mark LaPedus - 29 Sep, 2017 - Comments: 0

Chipmakers Who will buy Toshiba’s memory business? In the latest of what is becoming a confusing saga, Toshiba has signed a deal to sell its memory unit to a group led by Bain Capital. The Bain-led consortium will hold a 49.9% stake in the memory unit, while Toshiba will hold 40.2% and Japan’s Hoya will own 9.9%. Other members in the group include Apple, Dell, Kingston, and Seagate. In add... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 May, 2017 - Comments: 0

Chipmakers Samsung has formed a new foundry division and rolled out a range of new processes. Specifically, Samsung plans to develop 8nm, 7nm, 6nm, 5nm and 4nm. It also introduced an 18nm FD-SOI technology. GlobalFoundries has provided more details about its 300mm fab plans in China. The company and the Chengdu municipality have announced an investment to develop an ecosystem for its 22nm ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Feb, 2017 - Comments: 0

Chipmakers Recently, Intel announced plans to invest more than $7 billion to complete its previously-announced fab in Chandler, Ariz. Targeted for 7nm processes, Fab 42 will be completed in 3 to 4 years. As reported, the fab announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House. There is more to the story. Typically, Intel has two fabs for a gi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Feb, 2017 - Comments: 0

Chipmakers Intel has announced plans to invest more than $7 billion to complete its previously-announced fab in Chandler, Ariz. The fab was announced several years ago, but Intel delayed the plant in 2014. Now, the plant, dubbed Fab 42, is moving forward again. Targeted for 7nm technology, Fab 42 will be completed in 3 to 4 years and will create approximately 3,000 jobs. The announcement was m... » read more

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design
By David Vye - 15 Dec, 2016 - Comments: 0

The integration of simulation technologies, system prototyping tools, and automated test equipment is critical for addressing the complexity of developing 5G wireless technology. In these cases, design teams will need to rely on a combination of simulation and prototype testing in order to ensure design robustness. Although simulation is essential to design a test bed or prototype, measurement... » read more

Siemens To Buy Mentor For $4.5B
By Ed Sperling - 14 Nov, 2016 - Comments: 0

By Ed Sperling & Jeff Dorsch Siemens announced today that it has reached a deal to buy Mentor Graphics for $4.5 billion in cash. The move, if approved by regulators, would greatly expand Siemens' capabilities in multi-physics design and embedded software for everything from semiconductors to automotive wiring harnesses. The transaction is expected to close in the second quarter of 2017. Sie... » read more

RF GaN Gains Steam
By Mark LaPedus - 25 Jul, 2016 - Comments: 0

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Jul, 2016 - Comments: 0

Fab and test equipment The wafer inspection market is heating up. For example, Applied Materials announced its new e-beam inspection system for use in foundry, logic, DRAM and 3D NAND applications. In addition, KLA-Tencor introduced six wafer defect inspection and review systems for leading-edge IC device manufacturing. National Instruments has rolled out a second-generation vector sig... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 04 Sep, 2015 - Comments: 0

GlobalFoundries has partnered with Catena, a supplier of radio frequency (RF) communication IPs, to offer complete Wi-Fi and Bluetooth solutions for system-on-chip (SoC) designers targeting mobile, Internet-of-Things (IoT), RF connectivity markets. In addition, GlobalFoundries and QEOS are partnering to co-develop the industry’s first mmW CMOS platform. Samsung Electronics said that its 20... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 May, 2015 - Comments: 0

At an event, Samsung rolled out its 10nm finFET technology. The company also showed a 300mm wafer with 10nm finFET transistors. "We have silicon-based PDKs out," said Kelvin Low, senior director of foundry marketing for Samsung. Samsung plans to move into production with its 10nm finFET technology by the end of 2016, he said. IC Insights released its chip rankings in terms of sales in the fi... » read more

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