Big Shifts In Power Electronics Packaging
Packages are becoming more complex to endure high power, high temperature conditions across a variety of applications.
Chip Industry Week In Review
$3B for packaging program; DARPA's 3DHI; AI yield improvement tool; OpenAI CEO reinstated; EV consumer sentiment; SiC market projections; RISC-V security model; AI edge devices; ESD discharge; ML in failure analysis.
AI Accelerator Architectures Poised For Big Changes
Design teams are racing to boost speed and energy efficiency of AI as it begins shifting toward the edge.
DRAM Choices Are Suddenly Much More Complicated
The number of options and tradeoffs is exploding as multiple flavors of DRAM are combined in a single design.
Chip Industry Week In Review
Rapidus teams with Leti for 2nm ICs by 2027; Microsoft's custom chips; DoE's $3.5B battery investment; EMI noise fix in EVs; Siemens buys Insight EDA; fastest computers; NVIDIA's AI foundry service; Intel lawsuit and security fix.
RISC-V Wants All Your Cores
It is not enough to want to dominate the world of CPUs. RISC-V has every core in its sights, and it's starting to take steps to get there.
SRAM In AI: The Future Of Memory
Why SRAM is viewed as a critical element in new and traditional compute architectures.
Power Semis Usher In The Silicon Carbide Era
Price parity with silicon modules, increased demand in EVs, and more capacity are driving widespread adoption.
Why Chiplets Don’t Work For All Designs
Getting this wrong can increase power and cost, while reducing performance.
Building Better Bridges In Advanced Packaging
Leading-edge applications, from biotech to co-packaged optics, require choices in architectures, assembly methods, and materials for system performance.
ReRAM Seeks To Replace NOR
There is increased interest in ReRAM for embedded computing, especially in automotive applications, as more of its known issues are solved. Nevertheless, there is no one-size-fits-all NVM.
Sweeping Changes For Leading-Edge Chip Architectures
Large language models and huge data volumes are prompting innovation at every level.
Chip Industry Talent Shortage Drives Academic Partnerships
Universities, companies, and governments are forming broad partnerships to update skills and foster innovation in chips, security, AI, and related fields.
