Verification In The Open Source Era

By Brian Bailey - 25 Mar, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss what open source verification means today and what it should evolve into, with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Ashish Darbari, CEO of Axiomise; Simon Davidmann, CEO of Imperas Software; Serge Leef, program manager in the Microsystems Technology Office at DARPA; Tao Liu, staff hardwa... » read more

Waiting For Chiplet Standards

By Brian Bailey - 25 Mar, 2021 - Comments: 2

The need and desire for chiplets is increasing, but for most companies that shift will happen slowly until proven standards are in place. Interoperability and compatibility depend on many layers and segments of the supply chain coming to agreement. Unfortunately, fragmented industry requirements may lead to a plethora of solutions. Standards always have enabled increasing specialization. ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 19 Mar, 2021 - Comments: 0

Chipmakers and OEMs Micron will cease development of 3D XPoint, a next-generation memory technology. Micron also plans to sell a fab that produces 3D XPoint chips. For some time, Intel and Micron have co-developed 3D XPoint, which is based on phase-change memory technology. Intel sells solid-state storage drives (SSDs) using 3D XPoint. In a fab located in Utah, Micron is producing this memo... » read more

Chasing After Carbon Nanotube FETs

By Mark LaPedus - 18 Mar, 2021 - Comments: 6

Carbon nanotube transistors are finally making progress for potential use in advanced logic chips after nearly a quarter century in R&D. The question now is whether they will move out of the lab and into the fab. Several government agencies, companies, foundries, and universities over the years have been developing, and are now making advancements with carbon nanotube field-effect transi... » read more

Week In Review: Design, Low Power

By Jesse Allen - 12 Mar, 2021 - Comments: 0

Tools & IP Codasip unveiled three commercially licensed add-ons to the Western Digital SweRV Core EH1, aiming to allow it to be designed into a wider range of applications. The SweRV Core EH1 is a 32-bit, dual-issue, RISC-V ISA core with a 9-stage pipeline, open-sourced through CHIPS Alliance. The add-ons offer a floating-point unit (FPU) that supports the RISC-V single precision [F] and d... » read more

Week In Review: Design, Low Power

By Jesse Allen - 05 Mar, 2021 - Comments: 0

Tools Synopsys introduced Euclide, a next-generation hardware description language (HDL)-aware integrated development environment (IDE). Euclide aims to enable earlier detection of bugs and optimize code for design and verification flows by identifying complex design and testbench compliance checks during SystemVerilog and UVM development. It assists correct-by-construction code development th... » read more

Chiplets For The Masses

By Brian Bailey - 03 Mar, 2021 - Comments: 2

Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That's changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your system remains uncertain. While new fabrication nodes continue to be developed, scaling is coming to an end, be it for physical or e... » read more

The Chip Industry’s Next-Gen Roadmap

By Mark LaPedus - 21 Jan, 2021 - Comments: 1

Todd Younkin, the new president and chief executive of the Semiconductor Research Corp. (SRC), sat down with Semiconductor Engineering to talk about engineering careers, R&D trends and what’s ahead for chip technologies over the next decade. What follows are excerpts of that conversation. SE: As a U.S.-based chip consortium, what is SRC's charter? Younkin: The Semiconductor Research... » read more

Blog Review: Jan. 13

By Jesse Allen - 13 Jan, 2021 - Comments: 0

Siemens EDA's Harry Foster tracks trends in IC and ASIC design and finds that increased design size is only one dimension of the growing complexity challenge. Synopsys' Chris Clark and Dennis Kengo Oka predicts how the automotive industry will change in 2021, including new standards for security, increased use of AI and V2X technologies, and a growing focus on software. Cadence's Paul McL... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 08 Jan, 2021 - Comments: 0

Market research For some time, China has faced an enormous trade gap in semiconductors. In response, China has been developing its semiconductor industry with plans to make more of its chips. But China is expected to fall far short of its “Made in China 2025” goals for IC production, according to IC Insights. “IC Insights forecasts China-produced ICs will represent only 19.4% of its I... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: DARPA

Verification In The Open Source Era

Waiting For Chiplet Standards

Week In Review: Manufacturing, Test

Chasing After Carbon Nanotube FETs

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Chiplets For The Masses

The Chip Industry’s Next-Gen Roadmap

Blog Review: Jan. 13

Week In Review: Manufacturing, Test