tag: DARPA

Logic Chip, Heal Thyself
By SE Staff - 11 Feb, 2020 - Comments: 0

If a single fault can kill a logic chip, that doesn’t bode well for longevity of complex multi-chip systems. Obsolescence in chips is not just an industry ploy to sell more chips. It is a fact of physics that chips don’t last more than a few years, especially if overheated, and hit with higher voltage than it can stand. The testing industry does a great job finding defects during manufac... » read more

Startup Funding: January 2020
By Jesse Allen - 05 Feb, 2020 - Comments: 0

A dozen tech startup companies started 2020 with new funding, raising +$500 million between them. Three companies received an impressive amount of investment. Stanford spinout Skylo launched from stealth with $116M in total funding and a bold plan to connect IoT devices, particularly sensors in remote or difficult-to-access environments, with hubs that link them to a network of satellites. ... » read more

Security Risks In The Supply Chain
By Ed Sperling - 09 Jan, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss security in the supply chain with Warren Savage, research scientist in the Applied Research Laboratory for Intelligence and Security at the University of Maryland; Neeraj Paliwal, vice president and general manager of Rambus Security; Luis Ancajas, marketing director for IoT security software solutions at Micron; Doug Suerich, product evangelist at ... » read more

Election Security At The Chip Level
By Andy Patrizio - 02 Jan, 2020 - Comments: 3

Technological advances have changed every facet of our lives, from reading to driving to cooking, but one task remains firmly rooted in 20th-century technology — voting. Electronic voting remains doggedly unavailable to most, and almost always unusable to those who have it. For more than a decade, it seems every election is accompanied by numerous reports of voting machine problems. The mo... » read more

Die-To-Die Connectivity
By Ed Sperling - 22 Nov, 2019 - Comments: 0

Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how die-to-die communication is changing as Moore’s Law slows down, new use cases such as high-performance computing, AI SoCs, optical modules, and where the tradeoffs are for different applications.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTu... » read more

New Security Risks Create Need For Stealthy Chips
By Ed Sperling - 03 Oct, 2019 - Comments: 0

Semiconductors are becoming more vulnerable to attacks at each new process node due to thinner materials used to make these devices, as well as advances in equipment used to simulate how those chips behave. Thinner chips are now emitting light, electromagnetic radiation and various other types of noise, which can be observed using infrared and acoustic sensors. In addition, more powerful too... » read more

The Race For Better Computational Software
By Ed Sperling - 05 Sep, 2019 - Comments: 0

Anirudh Devgan, president of Cadence, sat down with Semiconductor Engineering to talk about computational software, why it's so critical at the edge and in AI systems, and where the big changes are across the semiconductor industry. What follows are excerpts of that conversation. SE: There is no consistent approach to how data will be processed at the edge, in part because there is no consis... » read more

Blog Review: Sept. 4
By Jesse Allen - 04 Sep, 2019 - Comments: 0

Synopsys' Taylor Armerding checks out Apple's newly expanded bug bounty program, with bounty payouts are increasing to compete with malicious actors, and why even with security-oriented development the practice of bug bounties will remain needed. Mentor's Colin Walls shares a few more embedded software tips, this time on external variables, delay loops in real time systems, and meaningful pa... » read more

System Bits: Sept. 3
By Jeff Dorsch - 03 Sep, 2019 - Comments: 0

Microprocessor built with carbon nanotubes Researchers at the Massachusetts Institute of Technology were able to design a microprocessor with carbon nanotubes and fabricate the chip with traditional processes, an advance that could be used in next-generation computers. Work on producing carbon nanotube field-effect transistors has gone on for some time. Fabricated at scale, those CNFETs oft... » read more

The Next New Memories
By Mark LaPedus - 15 Aug, 2019 - Comments: 2

Several next-generation memory types are ramping up after years of R&D, but there are still more new memories in the research pipeline. Today, several next-generation memories, such as MRAM, phase-change memory (PCM) and ReRAM, are shipping to one degree or another. Some of the next new memories are extensions of these technologies. Others are based on entirely new technologies or involve ar... » read more

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