SoC Integration Headaches Grow


As the number of IP blocks grows, so do the headaches of integrating the various pieces and making sure they perform as planned within a prescribed power envelope. This is easier said than done, particularly at the most advanced process nodes. There are more blocks, more power domains, more states and use-model dependencies, and there is much more contention for memories. There are physical ... » read more

Chip Manufacturing Data Now Requires Cloud Techniques


The parameters in semiconductor manufacturing are growing so large that an analysis method similar to what’s currently used for big data is now required. The good news is that big data analysis techniques, which process a vast amount of data such as search data and communication logs in the cloud, is entirely applicable to the data of semiconductor process. Photo 1: Opening view of AEC... » read more

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