tag: defect detection

Enhancing High Bandwidth Memory (HBM) Reliability With 3D X-ray Inspection
By Chris Rand - 09 Jun, 2026 - Comments: 0

High Bandwidth Memory (HBM) is revolutionizing AI, high-performance computing, and advanced graphics systems. Its 3D architecture—stacked DRAM dies interconnected via through-silicon vias (TSVs)—delivers exceptional bandwidth and efficiency. But this complexity introduces new challenges for inspection and quality assurance. Why 3D X-ray for HBM? Traditional 2D X-ray imaging cannot fully v... » read more

The Smart Advantage: How Artificial Intelligence Is Transforming Inspection And Metrology In Semiconductor Manufacturing
By Charlie Zhu - 14 Apr, 2026 - Comments: 0

There is no doubt that the semiconductor industry is in an era of rapid and profound transformation, driven by an increasing demand for smaller, faster, and more powerful chips. As the speed of innovation continues to advance, so does the pressure on semiconductor manufacturers to detect and address defects and inconsistencies with near-perfect accuracy to keep pace with this demand. Manual ... » read more

What’s Failing At The Interface
By Gregory Haley - 07 Apr, 2026 - Comments: 0

Key Takeaways The interface is where failures in advanced packaging become visible, but it's increasingly not where they originate. Weak interfaces often don't fail at time zero, but they do degrade due to parametric drift and margin erosion that binary test screens miss entirely. The temporary test interconnect is the largest variable in the measurement chain and must be controlled ... » read more

Research Bits: Mar. 31
By Jesse Allen - 31 Mar, 2026 - Comments: 0

2D hard mask material Researchers from Penn State University and University of Chemistry and Technology Prague propose using the 2D material chromium oxychloride (CrOCl) as a hard mask, because its layered structure is resistant to plasma etching and enables it to be an effective mask at smaller thicknesses. “This 2D material is like lasagna. It’s a layer-by-layer structure,” said Zih... » read more

Structural Integrity Assessment of IC Packaging Using Scanning Acoustic Microscopy (Arizona State Univ., Fraunhofer IMWS)
By Technical Paper Link - 19 Dec, 2025 - Comments: 0

A new technical paper titled "Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review" was published by researchers at Arizona State University and Fraunhofer Institute for Microstructure of Materials and Systems IMWS. Abstract "Microelectronic packaging is crucial for protecting, powering, and interconnecting semi... » read more

Macro Defect Inspection For Mission-Critical Defense, Aerospace, And Advanced R&D Fabs
By Errol Akomer - 18 Dec, 2025 - Comments: 0

Some fabs build consumer chips that sit inside phones and laptops. Others build chips that must survive in orbit, under the Arctic ice, or deep beneath the Earth’s surface. Fabs serving defense, aerospace, national laboratories, and other advanced R&D programs operate under some of the most stringent requirements in the industry. For these facilities, yield is not the only concern. Sec... » read more

A Universal Deep Learning Model For Segmenting Automated Optical Inspection Images
By Nordson Test And Inspection - 08 Apr, 2025 - Comments: 0

A new technical paper titled "A Universal AI-Powered Segmentation Model for PCBA and Semiconductor" was published by researchers at Nordson Corporation. "This paper introduces a novel universal deep learning model designed to segment AOI images for both PCBA and 17 semiconductor components, offering a more robust and adaptable solution for defect detection," states the paper. Read more he... » read more

Multi-Tier Die Stacking Enables Efficient Manufacturing
By Jessica Albright - 24 Oct, 2024 - Comments: 0

Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die stacking and hybrid bonding, enable increased integration density, therefore improving yield of high-quality devices. However, these highly precise processes require significant attention to defectivity... » read more

Achieving Zero Defect Manufacturing Part 3: Prevention Of Defects
By Prasad Bachiraju - 16 Sep, 2024 - Comments: 0

The concept of zero defect manufacturing has been around for decades, arising first in the aerospace and defense industry. Since then, this manufacturing approach has been adopted by the automotive industry, and it has only grown in importance as the sector transitions to electric vehicles. Given the role semiconductors play in today’s vehicles, and will play in the future, it is no surprise ... » read more

Achieving Zero Defect Manufacturing Part 2: Finding Defect Sources
By Prasad Bachiraju - 06 Aug, 2024 - Comments: 1

Semiconductor manufacturing creates a wealth of data – from materials, products, factory subsystems and equipment. But how do we best utilize that information to optimize processes and reach the goal of zero defect manufacturing? This is a topic we first explored in our previous blog, “Achieving Zero Defect Manufacturing Part 1: Detect & Classify.” In it, we examined real-time defe... » read more

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