Multi-Die Design Pushes Complexity To The Max

By Ann Mutschler - 29 Apr, 2024 - Comments: 1

Multi-die/multi-chiplet design has thrown a wrench into the ability to manage design complexity, driving up costs per transistor, straining market windows, and sending the entire chip industry scrambling for new tools and methodologies. For multiple decades, the entire semiconductor design ecosystem — from EDA and IP providers to foundries and equipment makers — has evolved with the assu... » read more

Better Choreography Required For Complex Chips

By Karen Heyman - 22 Jun, 2023 - Comments: 0

The rapidly growing number of features and options in chip design are forcing engineering teams to ratchet up their planning around who does what, when it gets done, and how various components will interact. In effect, more elements in the design flow need to be choreographed much more precisely. Some steps have to shift further left, while others need to be considered earlier in the plannin... » read more

Beyond The Water Cooler: 2020 Report On IC/ASIC Design And Verification Trends

By Harry Foster - 10 Jun, 2021 - Comments: 0

Verification and design engineers like to talk shop and discuss their experiences and visions. But even though engineers sharing stories around the water cooler (whatever form that takes—conferences, blogs, etc.) does provide all kinds of valuable insights, it doesn’t provide the full picture into the very large and complicated and extremely dynamic global semiconductor industry. To better ... » read more

Balancing Implementation Time, Complexity, Schedule

By Ann Mutschler - 09 Oct, 2014 - Comments: 0

Design complexity today is demanding all the creativity a design engineer can muster to figure out the best ways to optimize a design for the power situation the device will be operating under. Advanced techniques are being leveraged, to be sure, but in varying degrees, perhaps in part because these techniques impact the complexity of the design implementation. If there are four or five ... » read more

High-Level Gaps Emerge

By Ann Mutschler - 06 Oct, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the attributes of a high-level, front-end design flow, and why it is needed at present with Leah Clark, associate technical director for digital video technology at [getentity id="22649" e_name="Broadcom"]; Jon McDonald, technical marketing engineer at [getentity id="22017" e_name="Mentor Graphics"]; Phil Bishop, vice president of the System Level D... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.